CS43199 datasheet(109/111 Pages) CIRRUS

109 / 111 page

DS1113F1

109

CS4399

10.2 42-Ball WLCSP Package Dimensions

Figure 10-2. 42-Ball WLCSP Package Drawing

Table 10-2. 42-Ball WLCSP Package Dimensions

Dimension

Millimeters

Minimum

Nominal

Maximum

0.461

0.491

0.521

0.175

0.190

0.205

0.286

0.301

0.316

—

0.022

—

M—

2.000

—

N—

2.400

—

0.220

0.270

0.320

—

0.354

—

0.391

—

e—

0.400

—

X—

2.707

—

Y—

3.181

—

Notes: X/Y dimensions are estimates.

• Unless otherwise specified, tolerances are: Linear ±0.05 mm, Angular ±1 deg

Wafer Back Side

Side View

Bump Side

Ball A1

Location

Indicator

Notes:

• Controlling dimensions are in millimeters.

• Dimensioning and tolerances per ASME Y 14.5M-1994.

• The Ball A1 position indicator is for illustration purposes only and may not be to scale.

• Dimension “b” applies to the solder sphere diameter and is measured at the midpoint between the package body and the seating plane

datum Z.

• Dimension A3 describes the thickness of the backside film.

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