AMBE2000 datasheet(10/47 Pages) ETC

10 / 47 page

AMBE-2000™ Vocoder Chip

User’s Manual Version 3.0

page 10

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Confidential Proprietary, Subject to Change

3 Hardware Information

3.1 Special Handling Instructions

The AMBE-2000 uses the TM320-LC541-66 core. For more details on handeling, electrical characteristics, packaging, or

timing constraints please refer to the TMS320-C54x manual found at http://www-s.ti.com/sc/psheets/sprs039c/sprs039c.pdf

(Adobe Acrobat). Although the AMBE-2000™ Vocoder Chip incorporates input protection circuitry, to avoid damage from

the accumulation of a static charge, industry standard electrostatic discharge precautions and procedures must be employed

during handling and mounting.

The 100 pin TQFP package design of the AMBE-2000™ Vocoder Chip allows it to be mounted by infrared reflow, vapor-

phase reflow or equivalent processes. The peak package body temperature must not exceed 220

°C.

The AMBE-2000™ Vocoder Chip requires baking before mounting, if any of the following conditions exist:

•

Humidity indicator card (included in packaging) shows exposure to > 20 %

when read at 23°C + 5°C

•

Devices were not shipped in a package designated as “moisture

controlled.”

•

Not mounted within 168 hours of receipt, at factory conditions of <30°C

and <60% RH

•

If the device has not been stored at < 20% RH

DVSI’s recommended bake out procedures:

•

For low-temperature device containers: 192 hours at 40°C + 5°C / -0°C

and < 5% Relative Humidity

•

For high-temperature device containers : 24 hours at 125°C + 5°C.

3.1.1 Storage

To insure maximum shelf life in long term storage, AMBE-2000™ Vocoder Chips should be kept in a moisture controlled

package at <40

°C and <90% Relative Humidity

AMBE2000 Datasheet(PDF) 10 Page - List of Unclassifed Manufacturers