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LA02 Datasheet(PDF) 20 Page - Taoglas antenna solutions |
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LA02 Datasheet(HTML) 20 Page - Taoglas antenna solutions |
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20 / 20 page  SPE-15-8-040/B/WY Page 20 of 20 8. Recommended Reflow Temp Profile Phase Profile features Pb-Free Assembly (SnAgCu) PREHEAT -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(ts) form (Tsmin to Tsmax) 150℃ 200℃ 60-120 seconds RAMP-UP Avg. Ramp-up Rate (Tsmax to TP) 3℃/second(max) REFLOW -Temperature(TL) -Total Time above TL (t L) 217℃ 30-100 seconds PEAK -Temperature(TP) -Time(tp) 260℃ 5-10 second RAMP-DOWN Rate 6℃ / second max. Time from 25℃ to Peak Temperature 8 minutes max. Composition of solder paste 96.5Sn/3Ag/0.5Cu Solder Paste Model SHENMAO PF606-P26 |
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