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LMH6560 Datasheet(PDF) 18 Page - National Semiconductor (TI) |
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LMH6560 Datasheet(HTML) 18 Page - National Semiconductor (TI) |
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18 / 23 page ![]() Application Notes (Continued) noticeable. This causes a distinctive dip in the output fre- quency sweep and this dip varies depending upon the par- ticular capacitor as seen in Figure 10. To minimize peaking due to C L a series resistor for the purpose of isolation from the output stage should be used. A low valued resistor will minimize the influence of such a load capacitor. In a 50 Ω system as is common in high frequency circuits a 50 Ω series resistor is often used. Usage of the series resistor, as seen in Figure 11 eliminates the peaking but not the dip. The dip will vary with the particular capacitor. Using a resistor in series with a capacitor creates a rolloff of 6db/octave. Choice of a higher valued resistor, for example 500 Ω to 1kΩ, and a capacitor of hundreds of pf’s provides the expected response at lower frequencies. However, at high frequencies the internal inductance is appreciable and forms with the capacitor a series LC combination. USING GROUND PLANES A ground plane on a printed circuit board provides for a low ohmic connection everywhere on the board for use in con- necting supply voltages or grounds. Multilayer boards often make use of inner conductive layers for routing supply volt- ages. These supply voltage layers form a complete plane rather than using discrete traces to connect the different points together for the specified supply. Signal traces on the other hand are routed on outside layers both top and bottom. This allows for easy access for measurement purposes. Fortunately, only very high density boards have signal layers in the middle of the board. In an earlier section, the formula for Z was derived as: (6) The width of a trace is determined by the thickness of the board. In the case of a multilayer board the thickness is the space between the trace and the first supply plane under this trace layer. By common practice, layers do not have to be evenly divided in the construction of a pcb. Refer to Figure 12. The design of a transmission line design over a pcb is based upon the thickness of the different internal layers and the er of the board material. The pcb manufacturer can supply information about important specifications. For ex- ample, a nominal 1.6mm thick pcb produces a 50 Ω trace for a calculated width of 2.9mm. If this layer has a thickness of 0.35mm and for the same er, the trace width for 50 Ω should be of 0.63mm, as calculated from Equation 7, a derivation from Equation 6. (7) Using a trace over a ground plane has big advantages over the use of a standard single or double sided board. The main advantage is that the electric field generated by the signal transported over this trace is fixed between the trace and the ground plane e.g. there is almost no possibility of radiation. 20064251 FIGURE 10. 20064252 FIGURE 11. 20064255 FIGURE 12. www.national.com 18 |
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