Electronic Components Datasheet Search
  English  ▼

X  

RT9526AGE Datasheet(PDF) 11 Page - Richtek Technology Corporation

Part # RT9526AGE
Description  Linear Single Cell Li-Ion Battery Charger
PDF  13 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Manufacturer  RICHTEK [Richtek Technology Corporation]
Direct Link  http://www.richtek.com
Logo RICHTEK - Richtek Technology Corporation

RT9526AGE Datasheet(HTML) 11 Page - Richtek Technology Corporation

Back Button RT9526AGE Datasheet HTML 5Page - Richtek Technology Corporation RT9526AGE Datasheet HTML 6Page - Richtek Technology Corporation RT9526AGE Datasheet HTML 7Page - Richtek Technology Corporation RT9526AGE Datasheet HTML 8Page - Richtek Technology Corporation RT9526AGE Datasheet HTML 9Page - Richtek Technology Corporation RT9526AGE Datasheet HTML 10Page - Richtek Technology Corporation RT9526AGE Datasheet HTML 11Page - Richtek Technology Corporation RT9526AGE Datasheet HTML 12Page - Richtek Technology Corporation RT9526AGE Datasheet HTML 13Page - Richtek Technology Corporation  
Zoom Inzoom in Zoom Outzoom out
 11 / 13 page
background image
RT9526A
11
DS9526A-03 July 2014
www.richtek.com
©
Copyright
2014 Richtek Technology Corporation. All rights reserved.
is a registered trademark of Richtek Technology Corporation.
Figure 4. PCB Layout Guide
Layout Consideration
The RT9526A is a fully integrated low cost single-cell Li-
ion battery charger ideal for portable applications. Careful
PCB layout is necessary. For best performance, place all
peripheral components as close to the IC as possible. A
short connection is highly recommended. The following
guidelines should be strictly followed when designing a
PCB layout for the RT9526A.
Input capacitor should be placed close to the IC and
connected to the ground plane. The trace of input on
the PCB should be placed far away from the sensitive
devices and shielded by the ground.
The GND and exposed pad should be connected to a
strong ground plane for heat sinking and noise protection.
The connection of RISET should be isolated from other
noisy traces.
Output capacitor should be placed close to the IC and
connected to the ground plane to reduce noise coupling.
Figure 3. Derating Curve of Maximum Power Dissipation
ISET
VIN
ENB
PGB
BATT
GND
CHG_SB
7
6
5
1
2
3
4
8
9
IMIN
BATT
BATT
VIN
BATT
COUT
CIN
R1
R2
RISET
RIMIN
GND
CIN should be placed near the
IC to improve performance.
The copper area connecting the
resistors of ISET and IMIN should
be minimized and kept far away
from noise sources.
The GND plane should be connected to a strong
ground plane for heat sinking and noise protection.
PD(MAX) = (125
°C − 25°C) / (31.5°C/W) = 3.17W for
WDFN-8L 2x3 package
PD(MAX) = (125
°C − 25°C) / (208.2°C/W) = 0.48W for
SOT-23-6 package
The maximum power dissipation depends on the operating
ambient temperature for fixed TJ(MAX) and thermal
resistance,
θJA. The derating curve in Figure 3 allow the
designer to see the effect of rising ambient temperature
on the maximum power dissipation.
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0
25
50
75
100
125
Ambient Temperature (°C)
Four-Layer PCB
WDFN-8L 2x3
SOT-23-6



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13


Datasheet Download

Go To PDF Page


Link URL



Does ALLDATASHEET help your business so far?  [ DONATE ] 

About Alldatasheet   |   Advertisement   |   Contact us   |   Privacy Policy   |   Link to Datasheet    |   Link Exchange   |   Manufacturer List
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com