Dimensions in Inch(mm)

Features

Mechanical Data

■

Lead free product

■

Case Packed with

EPOXY

■

Leadless chip form, no lead Damage

▓

Mounting: Position Any

■

Lead free Solder joint

external

■

Terminals: Pure Tin Plated

■

Low profile package

Solderable per MIL-STD-

202E,

■

For surface mounted application

Method 20

8C

■

Built-in strain relief

■

Plastic package has Underwriters Lab.

■

Low power loss, high efficiency

■ Flammability Classification 94V-0

■

High current capability

■

Polarity: Laser Marking

A,B,G,J,K,M

■

High surge capacity

■

Weight: 0.0

64g

AB

G

JKM

Vrrm

100

200

400

600

800

1000

V

Vrms

70

140

280

420

560

700

V

Vdc

100 200

400

600

800

1000

V

Iav

A

IFSM

A

VF

V

trr

nS

Cj

pF

Tj,Tstg

C

Note 3: Preliminary Draft

IR

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

Note 1: Reverse recovery time test condition: IF 0.5A, IR 1.0A, Irr 0.25A

Note 2: Measured at 1.0MHz and applied reverse voltage of 4.0 voltage

3000

12

-65 to +175

uA

1

GS1B~1M

30

1.1

1.0

30

50

Maximum reverse recovery time(note1)

Typical junction capacitance(note2)

Operating junction and storage temperature range

Maximum instantaneous forward voltage at 1.0A

Maximum DC reverse current Ta=25C

at rated DC blocking voltage Ta=125C

Ta=150C

Maximum RMS voltage

Maximum DC blocking voltage

Maximum average forward rectified current

Peak forward surge current 8.3ms single half-wave

superimposed on rated load(JEDEC Method)

UNITS

Maximum rep

etitive peak reverse voltage

SOD-123

Rating at 25C ambient temperature

unless otherwise specified

SYMBOLS

1.0

Amp Glass Passivated

Surface Mount STD Diode