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LM4891M Datasheet(PDF) 17 Page - National Semiconductor (TI) |
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LM4891M Datasheet(HTML) 17 Page - National Semiconductor (TI) |
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17 / 20 page ![]() Physical Dimensions inches (millimeters) unless otherwise noted Note: Unless otherwise specified. 1. Epoxy coating. 2. 63Sn/37Pb eutectic bump. 3. Recommend non-solder mask defined landing pad. 4. Pin 1 is established by lower left corner with respect to text orientation pins are numbered counterclockwise. 5. Reference JEDEC registration MO-211, variation BC. 8-Bump micro SMD Order Number LM4891IBP, LM4891IBPX NS Package Number BPA08DDB X1 = 1.361±0.03 X2 = 1.361±0.03 X3 = 0.850±0.10 www.national.com 17 |
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