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RT9118 Datasheet(PDF) 13 Page - Richtek Technology Corporation

Part # RT9118
Description  10W Stereo Class-D Speaker Driver
PDF  14 Pages
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Manufacturer  RICHTEK [Richtek Technology Corporation]
Direct Link  http://www.richtek.com
Logo RICHTEK - Richtek Technology Corporation

RT9118 Datasheet(HTML) 13 Page - Richtek Technology Corporation

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RT9118
13
DS9118-00
November 2016
www.richtek.com
©
Copyright
2016 Richtek Technology Corporation. All rights reserved.
is a registered trademark of Richtek Technology Corporation.
Figure 4. Derating Curve of Maximum Power Dissipation
Figure 5. PCB Layout Guide
Layout Considerations
For the best performance of the RT9118, the below PCB
layout guidelines must be strictly followed.
Place the decoupling capacitors as close as possible to
the AVCC, PVDDL, PVDDR and GND pins. For achieving
a good quality, consider adding a small, good performance
low ESR ceramic capacitor between 220pF and 1000pF
and a larger mid-frequency capacitor between 0.1
μF and
1
μF to the PVDD pins of the chip. The traces of (LINP &
LINN, RINP & RINN) and (OUTPL & OUTNL, OUTPR &
OUTNR) should be kept equal width and length
respectively. The thermal pad must be soldered to the
PCB for proper thermal performance and optimal reliability.
The dimensions of the thermal pad and thermal land should
be larger for application. The vias should connect to a
solid copper plane, either on an internal layer or on the
bottom layer of the PCB.
GND
GND
GND
HPVDD
GND
PVDD
RT9118
GND
PVDD
GND
PVDD
EN
The decoupling capacitor
(CS) must be placed as
close to the IC as possible.
The decoupling capacitor
(Cs) must be placed as
close to the IC as
possible.
The decoupling
capacitor (CS) must
be placed as close to
the IC as possible.
CB
CB
CIN
The Negative Power
Supply Capacitor
must be placed as
close to the IC as
possible.
The Negative Power
Supply Capacitor
must be placed as
close to the IC as
possible.
Audio
Input
The Flying Capacitor
must be placed as
close to the IC as
possible.
LEFT
GND
RIGHT
JD
Headphone Jack
FB
FB
FB
FB
CB
CB
CS
0.1µF
2.2
2.2
INPL
INNL
INNR
INPR
GVDD
AVSS
HPL
HPR
VOUTPL
PVDDL
VOUTNL
BSTNL
BSTNR
VOUTNR
PVDDR
VOUTPR
CIN
CIN
CIN
0.0
0.4
0.8
1.2
1.6
2.0
2.4
2.8
3.2
3.6
4.0
0
255075
100
125
Ambient Temperature (°C)
Four-Layer PCB
the designer to see the effect of rising ambient temperature
on the maximum power dissipation.



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