TSML1000, TSML1020, TSML1030, TSML1040

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Vishay Semiconductors

Rev. 2.1, 13-Mar-14

4

Document Number: 81033

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

Fig. 9 - Relative Radiant Intensity vs. Angular Displacement

PRECAUTIONS FOR USE

1. Over-current-proof

Customer must apply resistors for protection, otherwise

slight voltage shift will cause big current change (burn out

will happen).

2. Storage

• Storage temperature and rel. humidity conditions are:

5

°C to 35 °C, R.H. 60 %.

• Floor life must not exceed 168 h, acc. to JEDEC level 3,

J-STD-020.

Once the package is opened, the products should be

used within a week. Otherwise, they should be kept in a

damp proof box with desiccant.

Considering tape life, we suggest to use products within

one year from production date.

• If opened more than one week in an atmosphere 5 °C to

35 °C, R.H. 60 %, devices should be treated at 60 °C

±

5 °C for 15 h.

• If humidity indicator in the package shows pink color

(normal blue), then devices should be treated with the

same conditions as 2.3.

REFLOW SOLDER PROFILE

Fig. 10 - Lead Tin (SnPb) Reflow Solder Profile

Fig. 11 - Lead (Pb)-Free Reflow Solder Profile acc. J-STD-020

18234

0.6

0.9

0.8

0°

30°

10°

20°

40°

50°

60°

70°

80°

0.7

1.0

0.6

0.4

0.2

0

0.2

0.4

60

80

100

120

140

160

180

200

220

240

260

0

20 40 60 80 100 120 140 160 180 200 220

Time (s)

17172

+ 5 °C/s

5 s

60 s to 120 s

- 5 °C/s

22566

120 s max.

60 s max.

above 220 °C

260 °C max.

10 s max.

Pre-heating

180 °C to 200 °C

1 °C/s to 5 °C/s

1 °C/s to 5 °C/s