Parameters

IRK.26

Units

I

T(AV)

or I

F(AV)

@ 85°C

I

O(RMS)

(*)

60

A

I

TSM

@ 50Hz

400

A

I

FSM

@ 60Hz

420

A

I

800

A

@ 60Hz

730

A

I

8000

A

V

RRM

range

400 to 1600

V

T

STG

- 40 to 125

- 40 to125

(*) As AC switch.

27

A

Major Ratings and Characteristics

27 A

THYRISTOR/ DIODE and

THYRISTOR/ THYRISTOR

IRK.26 SERIES

Bulletin I27130 rev. G 10/02

1

www.irf.com

Features

High Voltage

Industrial Standard Package

Thick Al metal die and double stick bonding

Thick copper baseplate

UL E78996 approved

3500V

Mechanical Description

The Generation V of Add-A-pak module combine the

excellent thermal performance obtained by the usage of

Direct Bonded Copper substrate with superior

mechanical ruggedness, thanks to the insertion of a solid

Copper baseplate at the bottom side of the device.

The Cu baseplate allow an easier mounting on the

majority of heatsink with increased tolerance of surface

roughness and improve thermal spread.

The Generation V of AAP module is manufactured without

hard mold, eliminating in this way any possible direct

stress on the leads.

Benefits

Up to 1600V

Full compatible TO-240AA

High Surge capability

Easy Mounting on heatsink

Al

Heatsink grounded

Electrical Description

These modules are intended for general purpose

high voltage applications such as high voltage regu-

lated power supplies, lighting circuits, temperature

and motor speed control circuits, UPS and battery

charger.

The electrical terminals are secured against axial pull-out:

they are fixed to the module housing via a click-stop feature

already tested and proved as reliable on other IR modules.