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LTC1850 Datasheet(PDF) 18 Page - Linear Technology |
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LTC1850 Datasheet(HTML) 18 Page - Linear Technology |
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18 / 28 page ![]() 18 LTC1850/LTC1851 18501f APPLICATIO S I FOR ATIO as free of breaks and holes as possible, such that a low impedance path between all ADC grounds and all ADC decoupling capacitors is provided. It is critical to prevent digital noise from being coupled to the analog inputs, reference or analog power supply lines. Layout for the printed circuit board should ensure that digital and analog signal lines are separated as much as possible. In particu- lar, care should be taken not to run any digital track alongside an analog signal track or underneath the ADC. An analog ground plane separate from the logic system ground should be established under and around the ADC. Pin 34 (OGND), Pin 13 (GND), Pin 16 (ADC’s GND) and all other analog grounds should be connected to this single analog ground point. The bypass capacitors should also be connected to this analog ground plane. No other digital grounds should be connected to this analog ground plane. In some applications, it may be desirable to connect the OVDD to the logic system supply and OGND to the logic system ground. In these cases, OVDD should be bypassed to OGND instead of the analog ground plane. Low impedance analog and digital power supply common returns are essential to the low noise operation of the ADC and the foil width for these tracks should be as wide as possible. In applications where the ADC data outputs and control signals are connected to a continuously active microprocessor bus, it is possible to get errors in the conversion results. These errors are due to feedthrough from the microprocessor to the successive approximation comparator. The problem can be eliminated by forcing the microprocessor into a WAIT state during conversions or by using three-state buffers to isolate the ADC bus. The traces connecting the pins and bypass capacitors must be kept short and should be made as wide as possible. The LTC1850/LTC1851 have differential inputs to mini- mize noise coupling. Common mode noise on the “+” and “–” inputs will be rejected by the input CMRR. The LTC1850/ LTC1851 will hold and convert the difference between whichever input is selected as the “+” input and whichever input is selected as the “–” input. Leads to the inputs should be kept as short as possible. SINGLE-ENDED/ DIFFERENTIAL BIT UNIPOLAR/ BIPOLAR BIT S6 S5 A2 A0 END OF SEQUENCE BIT PGA BIT 1851 F01 A1 MUX ADDRESS S4 S3 S2 S1 S0 Figure 1. Readback Status Word Unipolar Transfer Characteristic (UNI/BIP = 0) Bipolar Transfer Characteristic (UNI/BIP = 1) INPUT VOLTAGE (V) 0 FS – 1LSB 1111...1111 1111...1110 1111...1101 1000...0001 1000...0000 0111...1111 0111...1110 0000...0010 0000...0001 0000...0000 1851 F01A FS = VREFCOMP INPUT VOLTAGE (V) – FS –1LSB 0 1LSB FS – 1LSB 0111...1111 0111...1110 0111...1101 0000...0001 0000...0000 1111...1111 1111...1110 1000...0010 1000...0001 1000...0000 1851 F01B BIPOLAR ZERO FS = VREFCOMP 2 BOARD LAYOUT AND BYPASSING To obtain the best performance from the LTC1850/ LTC1851, a printed circuit board with ground plane is required. The ground plane under the ADC area should be |
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