CU20L60CT datasheet(1/3 Pages) CITC

Part #	CU20L60CT

Description	20A Trench Schottky Rectifier

PDF	3 Pages

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Manufacturer	CITC [Chip Integration Technology Corporation]

Direct Link	http://www.citcorp.com.tw/english/index.php

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1 / 3 page

1

Document ID : DS-11K009

Revised Date : 2016/07/28

Revision : C

Main Product Characteristics

I

F ( AV )

2 X 10A

V

R R M

T

J

V

F ( Ty p )

60V

150

OC

0.55V

20A Trench Schottky Rectiﬁer

CU20L60CT

Chip Integration Technology Corporation

Forward Voltage Drop (per diode)

Reverse Current (per diode)

Parameter

I

O

I

F S M

I

R R M

T

S T G

Forward Rectiﬁed Current (total device)

Forward Surge Current (per diode)

Thermal Resistance (per diode)

Storage Temperature

Parameter

8.3ms single half sine-wave

superimposed on rate load (JEDEC method)

Condition

Symbol

CU20L60CT

UNIT

-55 ~ +150

20

140

A

O C/W

O C

3

R

θ J C

Junction to case

Peak Repetitive Reverse Surge Current

A

2

Maximum DC Blocking Voltage

V

DC

60

V

F

I

R

V

= V

, T = 25

OC

R

RWM

J

V

= V

, T = 125

OC

R

RWM

J

Condition

Symbol

TYP.

UNIT

20

0.05

mV

mA

MIN.

MAX.

I = 10A, T = 25

OC

F

J

I = 10A, T = 125

OC

F

J

640

(per diode)

550

Junction to ambient

R

θ J A

65

T

J

O C

Operating Junction Temperature

I = 3A, T = 25

OC

440

580

■ Electrical Characteristics

Rating at 25

OC ambient temperature unless otherwise speciﬁed.

Pulse width 2us, 1000Hz, square wave

at TA 25oC,10 cycles

Reverse Breakdown Voltage (per diode)

F

J

IR = 0.1mA, TJ = 25

OC

V

BR

V

60

0.004

-55 ~ +150

■Outline

TO-251

Dimensions in inches and (millimeters)

■ Maximum Ratings

Rating at 25

OC ambient temperature unless otherwise speciﬁed.

■ Circuit Diagram

A

B

C

TO-251(IPAK)

Unit:mm

DIM MIN MAX

A

6.85 7.25

B

5.90 6.30

C

5.13 5.53

D

6.40 6.80

E

3.95 4.35

F

2.19 2.39

G

0.45 0.85

H

2.20 2.40

I

0.41 0.61

J

0.71 1.31

K

0.41 0.61

M

2.96 3.16

D

G

I

H

J

E

F

K

1

2

3

M

4

■ Features

■ Mechanical Data

Low forward voltage drop.

•

Excellent high temperature stability.

•

Fast switching capability.

•

Lead-free parts meet environmental standards of

•

MIL-STD-19500 /228

• Epoxy : UL94-V0 rated ﬂ ame retardant.

.

• Case : JEDEC TO-251 Molded plastic body

• Terminals : Solder plated, solderable per

MIL-STD-750, Method 2026

.

ed.

• Polarity: As mark

.

• Weight : Approximated 0.335 gram

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