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RB751G Datasheet(PDF) 1 Page - Chip Integration Technology Corporation

Part # RB751G
Description  30mA Surface Mount Small Signal Diodes
PDF  3 Pages
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Manufacturer  CITC [Chip Integration Technology Corporation]
Direct Link  http://www.citcorp.com.tw/english/index.php
Logo CITC - Chip Integration Technology Corporation

RB751G Datasheet(HTML) 1 Page - Chip Integration Technology Corporation

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1
Dimensions in inches and (millimeters)
Features
■
■ Mechanical data
■ Maximum ratings and electrical characteristics
Rating at 25
ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
OC
Outline
■
Extremely small surface mount type.
Silicon epitaxial planar chip, metal silicon junction.
Lead-free parts meet environmental standards of
MIL-STD-19500 /228
•
•
•
•
•
Low current rectification and high speed switching.
Suffix "G" indicates Halogen-free part, ex.RB751GG.
SOD-723
• Case : Molded plastic, SOD-723
• Terminals : Solder plated, solderable per
MIL-STD-750, Method 2026
• Polarity : Indicated by cathode band
• Weight : Approximated 0.00077 gram
• Epoxy:UL94-V0 rated flame retardant
RB751G
Marking code
Symbol
I
O
I
FSM
I
R
Mean rectifying current
Forward surge current
Reverse current
Parameter
8.3ms single half sine-wave superimposed on
rate load (JEDEC method)
V
= 30V DC
R
Conditions
Symbol
MIN.
TYP.
MAX.
UNIT
0.5
30
200
mA
mA
uA
Document ID : DS-22K0Q
Issued Date : 2010/05/05
Revised Date : 2012/05/31
Revision : C
Parameter
Maximum Recurrent Peak Reverse Voltage
Continuous reverse voltage
Marking code
Storage temperature
Maximum Instantaneous Forward Voltage@1mA DC
Power Dissipation
Thermal resistance
junction to ambient
Operating Temperature
V
RM
V
R
T
STG
V
F
P
D
R
θJA
T
J
RB751G
5
30
30
600
150
0.37
-40 ~ +125
-40 ~ +125
OC
UNIT
V
mW
V
OC/W
OC
30mA Surface Mount Small Signal Diodes
C
T
Capacitance between terminals
V
= 1V DC, f = 1MHz
R
pF
2
0.022(0.55)
0.018(0.45)
0.057(1.45)
0.053(1.35)
0.041(1.05)
0.037(0.95)


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