1/5

www.asb.co.kr

August 2017

High OIP3

Medium Power Amplifier Module

Parameter

Unit

Specifications

Min

Typ

Max

Frequency Range

MHz

900

1000

Gain

dB

30

31

Gain Flatness

dB

 1.0

 1.2

Noise Figure

dB

6.6

7.0

dBm

44

47

dB

-15 / -9

Output P1dB

dBm

28

29

sec

-

Supply Current

mA

370

400

Supply Voltage

V

5

Impedance



50

Package Type & Size

mm

Surface Mount Type, 10Wx10Lx3.8H

Operating temperature is -40

C to +85C.

1) OIP3 is measured with two tones at an output power of 12 dBm / tone separated by 1 MHz.

2) S11/S22 (max) is the worst value within the frequency band.

Pin Number

Function

2

RF In

5

RF Out

6

Vs

Others

Ground

Features

Note: 1. The number and size of ground via holes in

a circuit board is critical for thermal RF

grounding considerations.

2. We recommend that the ground via holes be

placed on the bottom of all ground pins for

better RF and thermal performance, as

shown in the drawing at the left side.

Description

Website: www.asb.co.kr

E-mail: sales@asb.co.kr

Tel: (82) 42-528-7223

Fax: (82) 42-528-7222

More Information

1-stage Single Type

·

= 30.0 dB @ 1000 MHz

·

NF of 6.6 dB over Frequency

·

Unconditionally Stable

·

Single 5V Supply

·

High OIP3 @ Low Current

Typ. @ T = 25

Specifications (in Production)

APM0950-P29

ASB Inc.

(Top View)

Solder Stencil Area

Ø

0.3 plated thru holes to ground plane

(Side View)

2 x Ø 2.0 plated thru holes to screw on heat sinker

(Recommended Footprint)

(Bottom View)

plerow

Outline Drawing (Unit: mm)

amplifier mini-module for such application band in

SMD package with the output P1dB of 29 dBm. It is

compactly designed for low current consumption and

high OIP3. Integrating all the components for biasing

and matching within the module enhances production

yield and throughput as well. It passes through the

stringent DC, RF, and reliability tests. Not sample test

but 100% quality control test is made before packing.