TMP03/TMP04

–16–

OUTLINE DIMENSIONS

advantage in this application because it produces a linear tem-

perature output while needing only one I/O pin and without

requiring an A/D converter.

PC BOARD

TMP04 IN SURFACE MOUNT PACKAGE

FAST MICROPROCESSOR, DSP, ETC., IN PGA PACKAGE

PGA SOCKET

Figure 13. Monitoring the Temperature of a High Power

Microprocessor Improves System Reliability

Thermal Response Time

The time required for a temperature sensor to settle to a speci-

fied accuracy is a function of the thermal mass of, and the

thermal conductivity between, the sensor and the object being

sensed. Thermal mass is often considered equivalent to capaci-

tance. Thermal conductivity is commonly specified using the

symbol

Θ, and can be thought of as thermal resistance. It is

commonly specified in units of degrees per watt of power trans-

ferred across the thermal joint. Thus, the time required for the

TMP03 to settle to the desired accuracy is dependent on the

package selected, the thermal contact established in that par-

ticular application, and the equivalent power of the heat source.

In most applications, the settling time is probably best deter-

mined empirically. The TMP03 output operates at a nominal

frequency of 35 Hz at 25

°C, so the minimum settling time reso-

lution is 27 ms.

REV. B

CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS

(IN PARENTHESES) ARE ROUNDED-OFF EQUIVALENTS FOR

REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.

COMPLIANT TO JEDEC STANDARDS TO-226-AA

3-Pin Plastic Header-Style Package [TO-92]

(T-3-1)

Dimensions shown in inches and (millimeters)

0.020 (0.51)

0.017 (0.43)

0.014 (0.36)

0.1150 (2.92)

0.0975 (2.48)

0.0800 (2.03)

0.165 (4.19)

0.145 (3.68)

0.125 (3.18)

1

2

3

BOTTOM VIEW

FRONT VIEW

0.0220 (0.56)

0.0185 (0.47)

0.0150 (0.38)

0.105 (2.68)

0.100 (2.54)

0.095 (2.42)

0.055 (1.40)

0.050 (1.27)

0.045 (1.15)

SEATING

PLANE

0.500 (12.70) MIN

0.205 (5.21)

0.190 (4.83)

0.175 (4.45)

0.210 (5.33)

0.190 (4.83)

0.170 (4.32)

8-Lead Standard Small Outline Package [SOIC_N]

Narrow Body

(R-8)

Dimensions shown in millimeters and (inches)

CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS

(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR

REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.

COMPLIANT TO JEDEC STANDARDS MS-012-AA

0.25 (0.0098)

0.17 (0.0067)

1.27 (0.0500)

0.40 (0.0157)

0.50 (0.0196)

0.25 (0.0099)

45°

8°

0°

1.75 (0.0688)

1.35 (0.0532)

SEATING

PLANE

0.25 (0.0098)

0.10 (0.0040)

4

1

8

5

5.00 (0.1968)

4.80 (0.1890)

4.00 (0.1574)

3.80 (0.1497)

1.27 (0.0500)

BSC

6.20 (0.2441)

5.80 (0.2284)

0.51 (0.0201)

0.31 (0.0122)

COPLANARITY

0.10