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CS2082 Datasheet(PDF) 3 Page - ON Semiconductor |
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CS2082 Datasheet(HTML) 3 Page - ON Semiconductor |
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3 / 12 page ![]() CS2082 http://onsemi.com 3 MAXIMUM RATINGS* Rating Value Unit Storage Temperature –40 to 150 °C VBAT –0.3 to 24 V VRES –0.3 to 30 V VCC –0.3 to 6.0 V ESD Susceptibility (Human Body Model) 500 V Power Dissipation (Non–Firing) 0.15 W Power Dissipation (Both Firing Loops With Squibs Shorted) 140 W Power Dissipation (Squib Resistance Measurement) 1.6 W Peak Transient Voltage (46 V Load Dump @ 14 V VBAT) 60 V Lead Temperature Soldering: Reflow: (SMD styles only) (Note 1) 230 peak °C 1. 60 second maximum above 183 °C. *The maximum package power dissipation must be observed. ELECTRICAL CHARACTERISTICS (4.75 V < VCC < 5.25 V, 8.0 V < VRES < 30 V, 9.0 V < VBAT < 18 V, –40 °C < TA < +85°C; unless otherwise stated.) Parameter Test Conditions Min Typ Max Unit Supply Requirements VCC Quiescent Current VCC = 5.25 V – 2.0 4.0 mA VBAT Quiescent Current VBAT = 18 V – 2.5 5.0 mA VBAT Measurement Current VBAT = 18 V, RSQUIB = 1.0 Ω – – 80 mA VRES Quiescent Current VRES = 30 V – – 1.0 mA VRES Firing Current VRES = 30 V – – 3.0 mA Power on Reset VBAT = 9.0 V, VRES = 10 V Power Reset Active Voltage VCC Falling 3.50 4.00 4.25 V Power Reset Off Voltage VCC Rising 3.65 4.20 4.50 V Hysteresis – 50 – – mV Low Side Driver VRES = 8.0 V = VRX, VCC = 5.0 V, VBAT = 8.0 V Saturation Voltage I = 1.2 A – – 1.8 V Current Limit (ILIMIT) VSLX – VFGX = 5.0 V 1.2 1.6 2.0 A Turn–on Delay Time From CS falling Edge, ID = 0.9 × ILIMIT(MIN) – – 75 µs Turn–off Delay Time From CS falling Edge, ID = 0.1 × ILIMIT(MIN) – – 25 µs High Side Driver VRES = 8.0 V = VRX, VCC = 5.0 V, VBAT = 8.0 V Saturation Voltage I = 1.2 A – – 1.8 V Current Limit (ILIMIT) VRX – VSHX = 5.0 V 1.2 2.0 2.5 A VR1 Quiescent Current Drivers off VRX = VRES = 30 V – – 1.0 mA VR2 Quiescent Current Drivers off VRX = VRES = 30 V – – 100 µA Turn–on Delay Time From CS falling Edge, ID = 0.9 × ILIMIT(MIN) – – 100 µs Turn–off Delay Time From CS falling Edge, ID = 0.1 × ILIMIT(MIN) – – 25 µs Thermal Shut Down Thermal Shutdown Temp Guaranteed by Design 150 180 210 °C Thermal Hysteresis Guaranteed by Design 30 40 60 °C |
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