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LM5025ASD Datasheet(PDF) 3 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
Part # LM5025ASD
Description  Active Clamp Voltage Mode PWM Controller
PDF  16 Pages
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Manufacturer  NSC [National Semiconductor (TI)]
Direct Link  http://www.national.com
Logo NSC - National Semiconductor (TI)

LM5025ASD Datasheet(HTML) 3 Page - National Semiconductor (TI)

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Pin Description (Continued)
PIN
NAME
DESCRIPTION
APPLICATION INFORMATION
8
OUT_A
Main output driver
Output of the main switch PWM output gate driver.
Output capability of 3A peak sink current.
9
OUT_B
Active Clamp output driver
Output of the Active Clamp switch gate driver.
Capable of 1.25A peak sink current..
10
PGND
Power ground
Connect directly to analog ground.
11
AGND
Analog ground
Connect directly to power ground. For the LLP
package option the exposed pad is electrically
connected to AGND.
12
SS
Soft-start control
An external capacitor and an internal 20µA current
source set the softstart ramp. The SS current source
is reduced to 1uA initially following a CS2
over-current event or an over temperature event.
13
COMP
Input to the Pulse Width Modulator
An internal 5K
Ω resistor pull-up is provided on this
pin. The external opto-coupler sinks current from
COMP to control the PWM duty cycle.
14
RT
Oscillator timing resistor pin
An external resistor connected from RT to ground
sets the internal oscillator frequency.
15
SYNC
Oscillator UP/DOWN synchronization input
The internal oscillator can be synchronized to an
external clock with a frequency 20% lower than the
internal oscillator’s free running frequency. There is
no constraint on the maximum sync frequency.
16
UVLO
Line Under-Voltage shutdown
An external voltage divider from the power source
sets the shutdown comparator levels. The
comparator threshold is 2.5V. Hysteresis is set by an
internal current source (20µA) that is switched on or
off as the UVLO pin potential crosses the 2.5V
threshold.
-
EP
Exposed PAD, underside of the LLP package
option
Internally bonded to the die substrate. Connect to
GND potential for low thermal impedance.
www.national.com
3



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