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PixArt Imaging Inc.

PAC7640 Product Datasheet

Enhanced QE Global Shutter Image Sensor

Version 1.1 | 11 Sep 2015 | 41002EN

PixArt Imaging Inc. http://www.pixart.com

All rights reserved. Any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission.

4.0 Mechanical Specifications

4.1

Mechanical Dimension

Figure 5. Package Mechanical Diagram

Table 7. Mechanical Dimension Specifications

Parameters

Symbol

Nominal

Min.

Max.

Unit

Package Body Dimension X

A

3421

3396

3446

μm

Package Body Dimension Y

B

3421

3396

3446

μm

Package Height

C

760

700

820

μm

Ball Height

C1

130

100

160

μm

Package Body Thickness

C2

630

585

675

μm

Thickness of Glass Surface to Wafer

C3

445

425

465

μm

Ball Diameter

D

250

220

280

μm

Total Pin Count

N

36

-

-

Counts

Pin Count X axis

N1

6

-

-

Counts

Pin Count Y axis

N2

6

-

-

Counts

Pin Pitch X axis

J1

500

-

-

μm

Pin Pitch Y axis

J2

500

-

-

μm

Edge to Pin Center Distance along X

S1

460.5

430.5

490.5

μm

Edge to Pin Center Distance along Y

S2

460.5

430.5

490.5

μm