Hi-Speed USB Host or Device PHY with ULPI Low Pin Interface

SMSC USB3300

11

Revision 1.02 (02-16-05)

PRODUCT PREVIEW

Package Outline

The USB3300 is offered in a compact 32 lead-free QFN package.

Figure 7 USB3300-EZK 32 Pin QFN Package Outline, 5 x 5 x 0.9 mm Body (Lead-Free)

Notes:

1. Controlling Unit: millimeter.

2. Dimension b applies to plated terminals and is measured between 0.15mm and 0.30mm from the

terminal tip. Tolerance on the true position of the leads is ± 0.05 mm at maximum material

conditions (MMC).

3. Details of terminal #1 identifier are optional but must be located within the zone indicated.

4. Coplanarity zone applies to exposed pad and terminals.

Table 2 32 Terminal QFN Package Parameters

MIN

NOMINAL

MAX

REMARKS

A

0.80

~

1.00

Overall Package Height

A1

0

~

0.05

Standoff

A2

0.60

~

0.80

Mold Thickness

A3

0.20 REF

Copper Lead-frame Substrate

D

4.85

~

5.15

X Overall Size

D1

4.55

~

4.95

X Mold Cap Size

D2

1.25

3.5

3.80

X exposed Pad Size

E

4.85

~

5.15

Y Overall Size

E1

4.55

~

4.95

Y Mold Cap Size

E2

1.25

3.5

3.80

Y exposed Pad Size

L

0.30

~

0.50

Terminal Length

e

0.50 Basic

Terminal Pitch

b

0.18

~

0.30

Terminal Width

ccc

~

~

0.08

Coplanarity