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LM2707MF Datasheet(PDF) 4 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
Part # LM2707MF
Description  Inductive-Boost Series LED Driver with Programmable Oscillator Frequency
PDF  19 Pages
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Manufacturer  NSC [National Semiconductor (TI)]
Direct Link  http://www.national.com
Logo NSC - National Semiconductor (TI)

LM2707MF Datasheet(HTML) 4 Page - National Semiconductor (TI)

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Electrical Characteristics (Notes 2, 7) (Continued)
Unless otherwise specified: V
IN = 3.0V, Lx = Open, VOVP = Open, VFB = GND, Cx = 300pF, VEN =VIN,TA = 25˚C.
Symbol
Parameter
Condition
Min
Typ
Max
Units
Open Circuit Protection Section (V
OVP pin)
V
OVP
Output Over-Voltage Protection
(Open Circuit)
Protection Activation Threshold
17.5
18.75
20.0
V
Protection Deactivation Threshold
17.0
18.25
19.5
V
Hysteresis
0.5
V
I
OVP
V
OVP Pin Input Current
V
OVP = 18.5V, VEN = 3V
50
100
µA
V
OVP = 18.5V, VEN = 0V
0.03
µA
Input Voltage Section (V
IN pin)
V
IN, Low
Undervoltage Lockout (Low
Voltage Stop)
Lockout Deactivation Threshold
1.8
2.0
2.3
V
Lockout Activation Threshold
1.7
1.9
2.2
V
Hysteresis
0.1
V
I
IN, Off
Shutdown Supply Current
V
EN = 0.3V
0.01
1
µA
I
IN, On
Quiescent Supply Current
V
FB = 1.0V
0.2
0.5
0.8
mA
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of
the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the
Electrical Characteristics tables.
Note 2: All voltages are with respect to the potential at the GND pin.
Note 3: For detailed soldering specifications and information, please consult the National Semiconductor Application Note titled: "Mounting of Surface Mount
Components".
Note 4: The Human body model is a 100pF capacitor discharged through a 1.5k
Ω resistor into each pin. (MIL-STD-883 3015.7) The machine model is a 200pF
capacitor discharged directly into each pin. (EAIJ)
Note 5: In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be
derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJMAX-OP = 125
oC), the maximum power
dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application (θJA), as given by the
following equation: TA-MAX =TJ-MAX-OP –(θJA xPD-MAX).
Note 6: Junction-to-ambient thermal resistance (
θJA) is highly application and board-layout dependent. The 125oC/W figure provided was measured on a 4-layer
test board conforming to JEDEC standards. In applications where high maximum power dissipation exists, special care must be paid to thermal dissipation issues
when designing the board layout.
Note 7: Min and Max limits are guaranteed by design, test, or statistical analysis. Typical (Typ) numbers are not guaranteed, but do represent the most likely norm.
Note 8: ILIMIT: The value of current source IL (DC measurement) when the switching operation is stopped by the IS comparator.
Note 9: RSC: Guaranteed by the design equation: ILIMIT = { 0.1V - [(2.3V x VIN)/300]}/RSC
Note 10: Do not connect the output circuit directly to GND: RSC might be damaged. (Excessive current will pass through RSC , the Schottky Diode, and the coil.)
www.national.com
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