| Electronic Components Datasheet Search |
|
LM2707MF Datasheet(PDF) 4 Page - National Semiconductor (TI) |
|
|
|
|||||||||||||||||||||||||||||
LM2707MF Datasheet(HTML) 4 Page - National Semiconductor (TI) |
|
4 / 19 page ![]() Electrical Characteristics (Notes 2, 7) (Continued) Unless otherwise specified: V IN = 3.0V, Lx = Open, VOVP = Open, VFB = GND, Cx = 300pF, VEN =VIN,TA = 25˚C. Symbol Parameter Condition Min Typ Max Units Open Circuit Protection Section (V OVP pin) V OVP Output Over-Voltage Protection (Open Circuit) Protection Activation Threshold 17.5 18.75 20.0 V Protection Deactivation Threshold 17.0 18.25 19.5 V Hysteresis 0.5 V I OVP V OVP Pin Input Current V OVP = 18.5V, VEN = 3V 50 100 µA V OVP = 18.5V, VEN = 0V 0.03 µA Input Voltage Section (V IN pin) V IN, Low Undervoltage Lockout (Low Voltage Stop) Lockout Deactivation Threshold 1.8 2.0 2.3 V Lockout Activation Threshold 1.7 1.9 2.2 V Hysteresis 0.1 V I IN, Off Shutdown Supply Current V EN = 0.3V 0.01 1 µA I IN, On Quiescent Supply Current V FB = 1.0V 0.2 0.5 0.8 mA Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical Characteristics tables. Note 2: All voltages are with respect to the potential at the GND pin. Note 3: For detailed soldering specifications and information, please consult the National Semiconductor Application Note titled: "Mounting of Surface Mount Components". Note 4: The Human body model is a 100pF capacitor discharged through a 1.5k Ω resistor into each pin. (MIL-STD-883 3015.7) The machine model is a 200pF capacitor discharged directly into each pin. (EAIJ) Note 5: In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJMAX-OP = 125 oC), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application (θJA), as given by the following equation: TA-MAX =TJ-MAX-OP –(θJA xPD-MAX). Note 6: Junction-to-ambient thermal resistance ( θJA) is highly application and board-layout dependent. The 125oC/W figure provided was measured on a 4-layer test board conforming to JEDEC standards. In applications where high maximum power dissipation exists, special care must be paid to thermal dissipation issues when designing the board layout. Note 7: Min and Max limits are guaranteed by design, test, or statistical analysis. Typical (Typ) numbers are not guaranteed, but do represent the most likely norm. Note 8: ILIMIT: The value of current source IL (DC measurement) when the switching operation is stopped by the IS comparator. Note 9: RSC: Guaranteed by the design equation: ILIMIT = { 0.1V - [(2.3V x VIN)/300]}/RSC Note 10: Do not connect the output circuit directly to GND: RSC might be damaged. (Excessive current will pass through RSC , the Schottky Diode, and the coil.) www.national.com 4 |
|
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |