Preliminary Technical Data

AD8661/AD8662/AD8664

-

4-

Rev PrA 10/5/04

Supply voltage.........................................................................+18V

Input Voltage ....................................................................Gnd to Vs

Differential Input Voltage .......................................................±18V

Storage Temperature Range

R, CP, RM, RU Package................................-65°C to +150°C

Operating Temperature Range

AD8661/AD8662/AD8664 ............................-40°C to +125°C

Junction Temperature Range

R, CP, RM, RU Package................................-65°C to +150°C

Lead Temperature Range (Soldering, 60 Sec)

............. +300°C

Package Type

θJA

θJC

Units

8-Pin LFCSP (CP)

--

°C/W

8-Pin microSOIC (RM)

210

45

°C/W

8-Pin SOIC (R)

158

43

°C/W

14-Pin SOIC (R)

120

36

°C/W

14-Pin TSSOP (RU)

180

35

°C/W

NOTES

1 Absolute maximum ratings apply at 25°C, unless otherwise noted.

2 θJA is specified for the worst-case conditions, i.e., θJAis specified for device soldered

in circuit board for surface mount packages.

ORDERING GUIDE

Model

Temperature

Range

Package

Description

Package

Option

Branding

Information

AD8661ACP

-40°C to +125°C

8-Pin LFCSP

CP-8

AD8661ARZ

-40°C to +125°C

8-Pin SOIC

R-8

AD8662ARMZ

-40°C to +125°C

8-Pin micro-SOIC

RM-8

AD8662ARZ

-40°C to +125°C

8-Pin SOIC

R-8

AD8664ARZ

-40°C to +125°C

14-Pin SOIC

R-14

AD8664ARUZ

-40°C to +125°C

14-Pin TSSOP

RU-14

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 1500 V

readily accumulate on the human body and test equipment and can discharge without

detection. Although this device features proprietary ESD protection circuitry, permanent

damage may occur on devices subjected to high-energy electrostatic discharges.

Therefore, proper ESD precautions are recommended to avoid performance degradation or

loss of functionality.