LM2780TP datasheet(3/7 Pages) NSC

3 / 7 page

Absolute Maximum Ratings (Notes 1,

If Military/Aerospace specified devices are required,

please contact the National Semiconductor Sales Office/

Distributors for availability and specifications.

IN pin: Voltage to GND

−0.3V to 5.8V

SD pin: Voltage to GND

-0.3V to

IN + 0.3V), with

5.8V max

Output Short-to-GND Duration

(Note 3)

1 sec.

Maximum Junction Temperature

J-MAX)

150˚C

Storage Temperature Range

-65˚C to +150˚C

Pad Temperature

(Soldering, 10 sec.)

265˚C

ESD Rating (Note 4)

Human-body model

Machine model

2kV

200V

Operating Ratings (Notes 1, 2)

Input Voltage Range

1.8V to 5.5V

Junction Temperature (T

J) Range

-40˚C to +90˚C

Ambient Temperature (T

A) Range

(Note 5)

-40˚C to +85˚C

Thermal Properties

Junction-to-Ambient Thermal

220˚C/W

Resistance (

JA), TPA08 Package

(Note 6)

Electrical Characteristics

(Notes 2, 7)

Limits in standard typface are for T

J = 25˚C, and limits in boldface type apply over the full operating junction temperature

range (-40˚C

≤ T

≤ +90˚C). Unless otherwise noted: specifications apply to the LM2780 Typical Application Circuit (pg. 1) with

IN = 5.0V, V(SD) = 0V, and CIN =COUT = C1 = C2 = 10µF. (Note 8)

Symbol

Parameter

Conditions

Min

Typ

Max

Units

OUT

Output Resistance

(Note 9)

OUT = 10mA, C2 = 10µF

Ω

OUT = 10mA, C2 removed

Ω

Supply Current

No load

120

µA

Shutdown Supply Current

V(SD) = 5.0V

0.1

0.5

µA

Switching Frequency

kHz

Shutdown Pin Logic Levels

Normal Operation

1.8V

≤ V

≤ 5.5V

0.5

Shutdown Mode

1.8V

≤ V

≤ 5.5V

0.5xV

OUTp-p

Output Voltage Ripple

IN = 5.0V, IOUT = 10mA

EFF

Power Efficiency

IN = 5.0V, IOUT = 10mA

Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of

the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the

Electrical Characteristics table.

Note 2: All voltages are with respect to the potential at the GND pin.

Note 3: VOUT may be shorted to GND for one second without damage when the ambient temperature is at or below 85˚C. Prolonged or repeated shorts of VOUT

to GND may damage the device, and should be avoided.

Note 4: The human-body model is a 100pF capacitor discharged through a 1.5k

Ω resistor into each pin. The machine model is a 200pF capacitor discharged

directly into each pin.

Note 5: Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 90˚C), the maximum power dissipation

of the device in the application (PD-MAX), and the junction-to-ambient thermal resistance of the part in the application (θJA), as given by the following equation:

TA-MAX =TJ-MAX-OP -(θJA xPD-MAX).

Note 6: Junction-to-ambient thermal resistance of the micro SMD package is highly application and board-layout dependent.

Note 7: Max and Min limits are guaranteed by design, test, or statistical analysis. Typical numbers are not guaranteed, but do represent the most likely norm.

Note 8: CIN,COUT, C1, and C2: Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) used in setting electrical characteristics.

Note 9: Output resistance is a model for the voltage drop at the output, resulting from internal switch resistance, capacitor ESR, and charge pump charge transfer

characteristics. Output voltage can be predicted with the following equation: VOUT = -[VIN -(IOUT xROUT)]

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