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SC9302D Datasheet(PDF) 37 Page - Silan Microelectronics Joint-stock |
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SC9302D Datasheet(HTML) 37 Page - Silan Microelectronics Joint-stock |
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37 / 39 page ![]() Silan Semiconductors SC9302 Series HANGZHOU SILAN MICROELECTRONICS JOINT-STOCK CO.,LTD Rev: 2.0 2001-11-01 37 CHIP TOPOGRAPHY 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 24 23 22 21 20 Chip size: 1.90 x 1.73 mm2 PAD COORDINATES (Unit: µm) Pad No. Symbol X Y Pad No. Symbol X Y 1 P1 -934.05 -225.30 13 P13 927.70 234.85 2 P2 -956.65 -503.00 14 P14 927.70 463.25 3 P3 956.65 -800.20 15 P15 890.75 619.10 4 P4 -668.20 -879.95 16 P16 937.55 839.50 5 P5 -391.80 -879.95 17 P17 761.90 875.45 6 P6 -137.60 -861.45 18 P18 363.20 875.45 7 P7 589.50 -845.65 19 P19 35.90 873.65 8 P8 846.10 -847.35 20 P20 -679.90 873.35 9 P9 899.15 -469.80 21 P21 -956.65 779.70 10 P10 954.35 -283.90 22 P22 -956.65 521.30 11 P11 927.70 -117.95 23 P23 -956.65 244.90 12 P12 927.70 71.75 24 P24 -940.35 -5.70 Note: The original point of the coordinate is the die center. |
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