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EXAMPLE BOARD LAYOUT

4X (

0.23)

(0.4) TYP

(0.4) TYP

(

0.23)

METAL

0.05 MAX

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

(

0.23)

SOLDER MASK

OPENING

0.05 MIN

4223507/A 01/2017

DSBGA - 0.5 mm max height

YFP0004

DIE SIZE BALL GRID ARRAY

NOTES: (continued)

3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.

For more information, see Texas Instruments literature number SNVA009 (www.ti.com/lit/snva009).

SOLDER MASK DETAILS

NOT TO SCALE

SYMM

SYMM

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE:50X

A

B

1

2

NON-SOLDER MASK

DEFINED

(PREFERRED)

EXPOSED

METAL

SOLDER MASK

DEFINED

EXPOSED

METAL