ESDA5-1F4 datasheet(6/9 Pages) STMICROELECTRONICS

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ESDA5-1F4 Datasheet(PDF) 6 Page - STMicroelectronics

Part #	ESDA5-1F4

Description	Low clamping single line unidirectional ESD

PDF	9 Pages

Scroll/Zoom	100%

Manufacturer	STMICROELECTRONICS [STMicroelectronics]

Direct Link	http://www.st.com

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6 / 9 page

Recommendation on PCB assembly

ESDA5-1F4

6/9

DocID030582 Rev 1

Recommendation on PCB assembly

3.1

Footprint

Figure 12: Footprint in mm

SMD footprint design is recommended.

3.2

Stencil opening design

Recommended design reference

Stencil opening thickness: 75 μm / 3 mils

Figure 13: Stencil opening recommendations

3.3

Solder paste

Halide-free flux qualification ROL0 according to ANSI/J-STD-004.

“No clean” solder paste is recommended.

Offers a high tack force to resist component movement during high speed.

Solder paste with fine particles: powder particle size is 20-

38 μm.

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