MAX3271 datasheet(4/8 Pages) MAXIM

4 / 8 page

+3.3V, 2.5Gbps Low-Power

Transimpedance Amplifier

_______________________________________________________________________________________

Typical Operating Characteristics (continued)

(VCC = +3.3V, CIN = 0.85pF, TA = +25°C, unless otherwise noted.)

Pin Description

BOND PAD

NAME

FUNCTION

FILTER

Provides bias voltage for the photodiode through a 750

Ω resistor to VCC. When grounded, this pin

disables the DC-cancellation amplifier to allow a DC path from IN to OUT+ and OUT- for testing.

N.C.

No Connection. Leave unconnected.

TIA Input

4, 5

VCC

Power Supply. Both pads must be connected to supply. Bond pad 4 supplies power to the

transimpedance stage. Bond pad 5 supplies power to the remaining circuitry.

6, 9

GND

Ground. Both pads must be connected to ground. Bond pad 9 is ground for the transimpedance stage.

Bond pad 6 is ground for the remaining circuitry.

OUT+

Noninverted Data Output. Current flowing into IN causes VOUT+ to increase.

OUT-

Inverted Data Output. Current flowing into IN causes VOUT- to decrease.

-35

-25

-30

-15

-20

-5

-10

1000

1500

500

2000

2500

3000

DIFFERENTIAL OUTPUT REFLECTION

COEFFICIENT

FREQUENCY (MHz)

100

150

200

250

300

350

400

-50

-25

100

OUTPUT AMPLITUDE vs. TEMPERATURE

(INPUT = 1mAp-p)

JUNCTION TEMPERATURE (

°C)

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