AD9731

3.1

Thermal Characteristics:

Thermal Resistance, SIDEBRAZED (D) Package

Junction-to-Case (

Θ

Junction-to-Ambient (

Θ

Thermal Resistance, BOTTOMBRAZED (F) Package

Junction-to-Case (

Θ

Junction-to-Ambient (

Θ

4.0

Electrical Table:

TABLE I

Parameter

See notes at end of table

Symbol

Conditions

Note 1

Sub­

group

Limit

Min

Limit

Max

Units

Differential Nonlinearity

DNL

1

1

LSB

2, 3

1.5

Integral Nonlinearity

INL

1

1

LSB

2, 3

1.5

Zero Scale Offset Error

IOS

1

70

μA

2, 3

100

Full Scale Gain Error (Note 2)

Ae

1, 2, 3

±5

% FS

Internal Reference Voltage

1

-1.35

-1.15

V

2, 3

-1.37

-1.13

Input Logic “1” Voltage

1, 2, 3

2

V

Input Logic “0” Voltage

1, 2, 3

0.8

Input Logic “1” Current

1, 2, 3

50

μA

Input Logic “0” Current

1, 2, 3

100

Positive Digital Supply Current

1

20

mA

2, 3

22

Negative Digital Supply Current

1

42

mA

2, 3

47

Negative Analog Supply Current

1

53

mA

2, 3

66

NOTES:

1

-1.25V, unless otherwise specified.

2

Measured as an error in ratio of full-scale current to current through RSET (640

μA nominal); ratio

is nominally 32. DAC load is virtual ground.

ASD0011259 Rev. I | Page 2 of 5