THS6132

SLLS543A – SEPTEMBER 2002 – REVISED FEBRUARY 2003

www.ti.com

2

Thesedevices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during

storage or handling to prevent electrostatic damage.

ORDERING INFORMATION

PRODUCT

PACKAGE

PACKAGE

SYMBOL

T

ORDER NUMBER

TRANSPORT

PRODUCT

PACKAGE

PACKAGE

CODE

SYMBOL

TA

ORDER NUMBER

TRANSPORT

MEDIA

THS6132VFP

TQFP 32 PowerPAD



VFP 32

THS6132

THS6132VFP

Tube

THS6132VFP

TQFP-32 PowerPAD



VFP–32

THS6132

–40

°Cto85°C

THS6132VFPR

Tape and reel

THS6132RGW

Leadless 25-pin 5,mm x

5, mm PowerPAD



RGW–25

6132

–40

°C to 85°C

THS6132RGWR

Tape and reel

PACKAGE DISSIPATION RATINGS

PACKAGE

ΘJA

ΘJC

TA ≤ 25°C

POWER RATING(1)

TA = 70°C

POWER RATING(1)

TA = 85°C

POWER RATING(1)

VFP–32

29.4

°C/W

0.96

°C/W

3.57 W

2.04 W

1.53 W

RGW–25

31

°C/W

1.7

°C/W

3.39 W

1.94 W

1.45 W

(1) Power rating is determined with a junction temperature of 130

°C. This is the point where distortion starts to substantially increase. Thermal

management of the final PCB should strive to keep the junction temperature at or below 125

_C for best performance.

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range unless otherwise noted(1)

THS6132

Supply voltage, VCC(H) and VCC(L) (2)

±16.5 V

Input voltage, VI

±VCC(L)

Output current, IO (3)

900 mA

Differential input voltage, VIO

±2 V

Maximum junction temperature, TJ (see Dissipation Rating Table for more information)

150

°C

Operating free–air temperature, TA

–40

°C to 85°C

Storage temperature, TStg

65

°C to 150°C

Lead temperature, 1,6 mm (1/16–inch) from case for 10 seconds

300

°C

HBM

1 kV

ESD ratings

CDM

500 V

ESD ratings

MM

200 V

(1) Stressesbeyondthoselistedunder“absolutemaximumratings”maycausepermanentdamagetothedevice.Thesearestressratingsonly,and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) VCC(H)mustalwaysbegreaterthanorequaltoVCC(L)forproperoperation.Class-ABmodeoperationoccurswhenVCC(H)isequaltoVCC(L)

and is considered acceptable operation for the THS6132 even though it is not fully specified in this mode of operation.

(3) TheTHS6132 incorporates a PowerPAD on the underside of the chip. This acts as a heatsink and must be connected to a thermally dissipating

plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature that could permanently damage

the device. See TI Technical Brief SLMA002 for more information about utilizing the PowerPAD thermally enhanced package.

PowerPAD is a trademark of Texas Instruments.