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INA231

SBOS644B – FEBRUARY 2013 – REVISED AUGUST 2017

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Copyright © 2013–2017, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Device Comparison Table..................................... 3

6

Pin Configuration and Functions ......................... 3

7

Specifications......................................................... 4

7.1

Absolute Maximum Ratings ...................................... 4

7.2

ESD Ratings.............................................................. 4

7.3

Recommended Operating Conditions ....................... 4

7.4

Thermal Information .................................................. 4

7.5

Electrical Characteristics .......................................... 5

7.6

7.7

Typical Characteristics .............................................. 7

8

Detailed Description ............................................ 10

8.1

Overview ................................................................. 10

8.2

Functional Block Diagram ....................................... 10

8.3

Feature Description................................................. 10

8.4

Device Functional Modes........................................ 14

8.5

Programming .......................................................... 15

8.6

Register Maps ......................................................... 22

9

Application and Implementation ........................ 28

9.1

Application Information............................................ 28

9.2

Typical Applications ................................................ 30

10

Power Supply Recommendations ..................... 32

11

Layout................................................................... 32

11.1

Layout Guidelines ................................................. 32

11.2

Layout Example .................................................... 32

12

Device and Documentation Support ................. 33

12.1

Receiving Notification of Documentation Updates 33

12.2

Community Resources.......................................... 33

12.3

Trademarks ........................................................... 33

12.4

Electrostatic Discharge Caution ............................ 33

12.5

Glossary ................................................................ 33

13

Mechanical, Packaging, and Orderable

Information ........................................................... 33

4 Revision History

Changes from Revision A (June 2017) to Revision B

Page

•

Changed NC pin description from "No internal connection" to "Do not connect, leave floating" .......................................... 3

•

•

Added text to end of Layout Guidelines section clarifying no connection of NC pins .......................................................... 32

Changes from Original (February 2013) to Revision A

Page

•

Added Device Information, Recommended Operating Conditions, and ESD Ratings tables, and Detailed

Description , Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation

Support , and Mechanical, Packaging, and Orderable Information sections ......................................................................... 1

•

Added new WSCP-12 (YFD) package with 0.4-mm package height and associated content to data sheet......................... 1

•

•

Added new note 1 to Timing Requirements: I2C Bus section ............................................................................................... 6

•

Added test condition to Figure 2 ............................................................................................................................................ 7