VSC8062FC datasheet(17/20 Pages) VITESSE

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VITESSE

SEMICONDUCTOR CORPORATION

G52069-0, Rev 4.3

Page 17

05/11/01

Tel: (800) VITESSE • FAX: (805) 987-5896 • Email: prodinfo@vitesse.com

Internet: www.vitesse.com

Data Sheet

VSC8061/VSC8062

Multiplexer/Demultiplexer Chipset

2.5Gb/s 16-Bit

The worst-case temperature rise from case to ambient is given by the equation:

where:

θSA

Theta sink-to-ambient

θCS

Theta case-to-sink

ΤA(MAX) = Air temperature, user supplied (typically +55o C)

ΤC(MAX) = Case temperature (+85oC for Industrial range)

∆T

TC - TA

P(MAX) =

Power (2.0 W for VSC8061)

Ιf TA = 55

o C and θCS (user supplied) is typically 0.6o C/W,

Therefore, to maintain the proper case and junction temperature, a heat sink with a

θSA of 14.4oC/W or less

must be selected at the appropriate air flow.

NOTE: The heat spreader is tied to VEE in both the VSC8061 and VSC8062.

∆TP MAX

() θSA

θCS

()

∴

∆T

Σθ

-------

TC TA

–

θSA θCS

---------------------------

θSA

∆T

-------

θCS

–

θSA

85 55

–

(

)°C

----------------------------- 0.6

°CW

⁄

–

θSA 14.4°CW

⁄

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