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HT32F22366 Datasheet(PDF) 2 Page - Holtek Semiconductor Inc |
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HT32F22366 Datasheet(HTML) 2 Page - Holtek Semiconductor Inc |
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2 / 56 page ![]() Rev. 1.00 � of 56 �ove��e� 0�� �01� 3�-Bit A��® Co�tex®-M3 MCU HT3�F1�365/HT3�F1�366/HT3�F��366 Table of Contents 1 General Description................................................................................................ 6 2 Features................................................................................................................... 7 Co�e ....................................................................................................................................... � On-chip Me�o�y .................................................................................................................... � Flash Me�o�y Cont�olle� – FMC............................................................................................ � Reset Cont�ol Unit – RSTCU ................................................................................................. 8 Clock Cont�ol Unit – CKCU.................................................................................................... 8 Powe� Manage�ent – PWRCU ............................................................................................. 8 Exte�nal Inte��upt/Event Cont�olle� – EXTI ............................................................................ 9 Analog to Digital Conve�te� – ADC ........................................................................................ 9 Analog Co�pa�ato� – CMP.................................................................................................... 9 I/O Po�ts – GPIO.................................................................................................................. 10 Moto� Cont�ol Ti�e� – MCTM .............................................................................................. 10 PWM Gene�ation and Captu�e Ti�e�s – GPTM .................................................................. 11 Basic Function Ti�e� – BFTM ............................................................................................. 11 Watchdog Ti�e� – WDT....................................................................................................... 11 Real Ti�e Clock – RTC ....................................................................................................... 1� Inte�-integ�ated Ci�cuit – I�C ................................................................................................ 1� Se�ial Pe�iphe�al Inte�face – SPI ......................................................................................... 1� Unive�sal Synch�onous Asynch�onous Receive� T�ans�itte� – USART............................. 13 Unive�sal Asynch�onous Receive� T�ans�itte� – UART ...................................................... 13 S�a�t Ca�d Inte�face – SCI ................................................................................................. 14 Inte�-IC Sound – I�S............................................................................................................. 14 Cyclic Redundancy Check – CRC ....................................................................................... 14 Pe�iphe�al Di�ect Me�o�y Access – PDMA ......................................................................... 15 Exte�nal Bus Inte�face – EBI................................................................................................ 15 Unive�sal Se�ial Bus Device Cont�olle� – USB .................................................................... 16 Advanced Enc�yption Standa�d – AES ................................................................................ 16 Secu�e Digital Input Output – SDIO..................................................................................... 16 CMOS Senso� Inte�face – CSIF (HT3�F��366 only) .......................................................... 1� De�ug Suppo�t..................................................................................................................... 1� Package and Ope�ation Te�pe�atu�e.................................................................................. 1� 3 Overview................................................................................................................ 18 Device Info��ation............................................................................................................... 18 Block Diag�a� ..................................................................................................................... 19 |
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