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CCG2 Datasheet(PDF) 27 Page - Cypress Semiconductor |
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CCG2 Datasheet(HTML) 27 Page - Cypress Semiconductor |
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27 / 33 page ![]() EZ-PD™ CCG2 Datasheet Document Number: 001-93912 Rev. *L Page 27 of 33 Packaging Figure 15. 20-ball WLCSP (1.63 × 2.03 × 0.55 mm) FN20B Package Outline, 001-95010 Table 28. Package Characteristics Parameter Description Conditions Min Typ Max Units TA Operating ambient temperature Industrial –40 25 85 °C Extended Industrial 105 °C TJ Operating junction temperature Industrial –40 – 100 °C Extended Industrial 125 °C TJA Package JA (20-ball WLCSP) – – 66 – °C/W TJC Package JC (20-ball WLCSP) – – 0.7 – °C/W TJA Package JA (14-pin DFN) – – 31 – °C/W TJC Package JC (14-pin DFN) – – 59 – °C/W TJA Package JA (24-pin QFN) – – 22 – °C/W TJC Package JC (24-pin QFN) – – 29 – °C/W Table 29. Solder Reflow Peak Temperature Package Maximum Peak Temperature Maximum Time within 5 °C of Peak Temperature 20-ball WLCSP 260 °C 30 seconds 14-pin DFN 260 °C 30 seconds 24-pin QFN 260 °C 30 seconds Table 30. Package Moisture Sensitivity Level (MSL), IPC/JEDEC J-STD-2 Package MSL 20-ball WLCSP MSL 1 14-pin DFN MSL 3 24-pin QFN MSL 3 TOP VIEW BOTTOM VIEW SIDE VIEW NOTES: 1. REFERENCE JEDEC PUBLICATION 95, DESIGN GUIDE 4.18 2. ALL DIMENSIONS ARE IN MILLIMETERS 4 3 2 1 E D C B A 4 3 2 1 E D C B A 001-95010 *A |
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