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S70GL02GS Datasheet(PDF) 1 Page - Cypress Semiconductor

Part # S70GL02GS
Description  2 Gbit (256 MBytes), 3.0 V Flash Memory
PDF  19 Pages
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Manufacturer  CYPRESS [Cypress Semiconductor]
Direct Link  http://www.cypress.com
Logo CYPRESS - Cypress Semiconductor

S70GL02GS Datasheet(HTML) 1 Page - Cypress Semiconductor

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S70GL02GS
2 Gbit (256 MBytes), 3.0 V Flash Memory
Cypress Semiconductor Corporation
198 Champion Court
San Jose
, CA 95134-1709
408-943-2600
Document Number: 001-98296 Rev. *J
Revised August 09, 2017
General Description
The Cypress S70GL02GS 2-Gigabit MirrorBit
® Flash memory device is fabricated on 65 nm MirrorBit Eclipse process technology. This
device offers a fast page access time of 25 ns with a corresponding random access time of 110 ns. It features a Write Buffer that
allows a maximum of 256 words/512 bytes to be programmed in one operation, resulting in faster effective programming time than
standard single byte/word programming algorithms. This makes the device an ideal product for today’s embedded applications that
require higher density, better performance and lower power consumption.
This document contains information for the S70GL02GS device, which is a dual die stack of two S29GL01GS die. For detailed
specifications, please refer to the discrete die datasheet.
Distinctive Characteristics
 CMOS 3.0 Volt Core with Versatile I/O™
 Two 1024 Megabit (S29GL01GS) in a single 64-ball
Fortified-BGA package (see S29GL01GS datasheet for full
specifications)
 65 nm MirrorBit Eclipse™ process technology
 Single supply (V
CC) for read / program / erase (2.7V to 3.6V)
 Versatile I/O Feature
– Wide I/O voltage (VIO): 1.65V to VCC
 x16 data bus
 16-word/32-byte page read buffer
 512-byte Programming Buffer
– Programming in Page multiples, up to a maximum of 512
bytes
 Sector Erase
– Uniform 128-Kbytes sectors
– S70GL02GS: two thousand forty-eight sectors
 Suspend and Resume commands for Program and Erase
operations
 Status Register, Data Polling, and Ready/Busy pin methods
to determine device status
 Advanced Sector Protection (ASP)
– Volatile and non-volatile protection methods for each
sector
 Separate 1024-bye One Time Program (OTP) array with two
lockable regions
– Available in each device Support for CFI (Common Flash
Interface)
 WP# input
– Protects first or last sector, or first and last sectors of each
device, regardless of sector protection settings
 Industrial temperature range (40°C to +85°C)
 Automotive AEC-Q100 Grade 3 (40°C to +85°C)
 Automotive AEC-Q100 Grade 2 (40°C to +105°C)
 100,000 erase cycles per sector typical
 20-year data retention typical
 Packaging Options
– 64-ball LSH Fortified BGA, 13 mm
 11 mm
Document
Cypress Document Number
S29GL01GS Datasheet
001-98285


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