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Enviromental Characteristics

Test Item

Test Method

Specification

Cold resistance

After -40±3

℃

(1000hrs) / room temp.,normal humidity(4 hrs)

cycle, measure the properties.

Within standard mentioned in

Initial Characteristics.

Within standard mentioned in

Initial Characteristics.

Within standard mentioned in

Initial Characteristics.

Within standard mentioned in

Initial Characteristics.

After 125±2

℃

(1000hrs) / room temp.,normal humidity(4 hrs)

cycle, measure the properties.

After 85±2

℃

RH85%(1000hrs) / room temp.,normal humidity(4

hrs) cycle, measure the properties.

25 times repetition of cycle -40±3

℃

(30 Min.),roon temp., (4 Min.), 125±2

(30Min.),

℃

room temp., normal humidity(4hrs) .

Heat resistance

Temperature resistance

Temperature period

Tensile strength

Bending strength

Resistance to soldering

attachment

（）

by solder dip

Resistance to soldering

heat

（）

by solder dip

Apply 2.5kgs load approximately 30 seconds, then check

for pull-out and breaking of the lead wire.

Within standard mentioned in

Initial Characteristics.

Within standard mentioned in

Initial Characteristics.

Bend the lead wire, with jig which radius is 0.75~0.8mm, at the point

of 2mm from the body, under 0.25 kgs load applied at the right angle

the direction of theamis and get the bent lead wire back to its

original poing after the procedure was repeated 2times.

Apply flux and immerse in molten solder, up to the point of

3mm from the body,for 5 sec. (235

±5

). Wash

℃℃

the leadwire and check for soldering adhesion.

Lead wire is evenly covered by

solder over 90%.

Apply flux and immerse in molten solder, up to the point of 3mm

from the body,for 5 sec. (235

±5

). Wash the leadwire

℃℃

and check forsoldering adhesion.)

Within standard mentioned in

Initial Characteristics.

Recommended wave slodering profile

REV 2018 02 29

GDT/GSP***Q Series