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HMC465LP5 Datasheet(PDF) 4 Page - Analog Devices

Part # HMC465LP5
Description  GaAs pHEMT MMIC LOW NOISE HIGH IP3 AMPLIFIER
PDF  8 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

HMC465LP5 Datasheet(HTML) 4 Page - Analog Devices

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For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
4
HMC465LP5 / 465LP5E
v07.0418
GAAS PHEMT MMIC MODULATOR DRIVER
AMPLIFIER, DC - 20 GHz
Outline Drawing
Absolute Maximum Ratings
Drain Bias voltage (vdd)
+9 vdc
Gate Bias voltage (vgg1)
-2 to 0 vdc
Gate Bias current (igg1)
+3.2mA
Gate Bias voltage (vgg2)
(vdd -8) vdc to +3 vdc
Gate Bias current (igg2)
+3.2mA
rf input power (rfin)(vdd = +8 vdc)
+23 dBm
channel Temperature
150 °c
continuous pdiss (T = 85 °c)
(derate 24 mW/°c above 85 °c)
1.56 W
Thermal resistance
(channel to ground paddle)
41.5 °c/W
storage Temperature
-65 to +150 °c
operating Temperature
-40 to +85 °c
vdd (v)
idd (mA)
+7.5
161
+8.0
160
+8.5
159
Typical Supply Current vs. Vdd
part number
package Body material
lead finish
msl rating
package marking [3]
Hmc465lp5
low stress injection molded plastic
sn/pb solder
msl1
[1]
H465
XXXX
Hmc465lp5e
roHs-compliant low stress injection molded plastic
100% matte sn
msl1
[2]
H465
XXXX
[1] max peak reflow temperature of 235 °c
[2] max peak reflow temperature of 260 °c
[3] 4-Digit lot number XXXX
Package Information
elecTrosTATic sensiTive Device
oBserve HAnDlinG precAUTions
32-Lead Lead Frame Chip Scale Package [LFCSP]
5 x 5 mm Body and 0.85 mm Package Height
(HCP-32-1)
Dimensions shown in millimeters
1
0.50
BSC
BOTTOM VIEW
TOP VIEW
PIN 1
INDICATOR
32
9
16
17
24
25
8
EXPOSED
PAD
SEATING
PLANE
0.05 MAX
0.02 NOM
0.20 REF
COPLANARITY
0.08
0.30
0.25
0.18
5.10
5.00 SQ
4.90
0.90
0.85
0.80
0.45
0.40
0.35
0.20 MIN
3.80
3.70 SQ
3.60
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-4.
3.50 REF
PIN 1
INDICATOR AREA OPTIONS
(SEE DETAIL A)
DETAIL A
(JEDEC 95)
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
32-lead lead frame chip scale package [lfcsp]
5 mm × 5 mm and 0.85 mm package Height
(Hcp-32-1)
Dimensions shown in millimeters.



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