NICHIA STS-DA1-1304B <Cat.No.110331>

5

SOLDERING

• Recommended Reflow Soldering Condition(Lead-free Solder)

• Recommended Manual Soldering Condition

Temperature

350°C Max

Soldering Time

3sec Max

● Recommended Soldering Pad Pattern

(単位 Unit: mm)

4.1

0.6

* The product is designed to be reflow soldered to a PCB. If you use dip soldering for the products,

Nichia cannot guarantee its reliability.

* Reflow soldering must not be performed more than twice. Manual soldering must only be done once.

* Care should be taken to avoid cooling at a rapid rate and ensure the peak temperature ramps down slowly.

* Customer is advised to use nitrogen reflow soldering as air flow process can cause optical degradation

due to the heat and atmosphere of reflow soldering.

* Since silicone used as encapsulating resin in this product is a soft material, do not press on the encapsulant.

Failure to comply might lead to nicks, chip-outs, delamination and deformation of the encapsulant, bump breakage

and an adverse effect on product reliability.

When using automatic pick and place machine, use a pick up nozzle which does not directly apply stress

to the encapsulation of the LEDs.

Recommended conditions:

It is recommended to use a pick up nozzle designed for the LEDs. (See Figure below.)

* Avoid direct contact to the resin lens

with the picking up nozzle.

Failure to comply might result in catastrophic failure

of the LEDs due to bump damage or breakage.

(単位 Unit: mm)

3

3.8

* Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,

a double-head soldering iron should be used.

It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.

* When soldering, avoid applying any stress to the LED package while heated.

120sec Max

Pre-heat

180 to 200°C

260°C Max

10sec Max

60sec Max

Above 220°C

1 to 5°C per sec