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13

LVR Series

Low-TCR Current Sense Chips

pe R fo R mance data

Test Method

Procedure

Requirements

Short time

overload

IEC60115-1 4.13

2.5 times of rated power for 5 seconds at room temperature

±(1%+0.0005Ω)

No visible damage

High

Temperature

Exposure

MIL-STD-202-Method

108

1,000 hours at maximum operating temperature depending on speci-

fication, unpowered. No direct impingement of forced air to the parts

Tolerances: 125±5ºC

±(1.0%+0.0005Ω)

Moisture

Resistance

MIL-STD-202-Method

106

Each temperature / humidity cycle is defined at 8 hours (method 106F),

3 cycles / 24 hours for 10d with 25ºC / 65ºC 95% R.H, without steps 7a

& 7b, unpowered

±(0.5%+0.0005Ω)

Operational

Life/

Endurance

MIL-STD-202 Method

108

IEC 60115-1 4.25.1

1,000 hours at 70±2ºC applied RCWV. 1.5 hours on, 0.5 hour off, still air

required

±(1.0%+0.0005Ω)

Solderability -

Wetting

J-STD-002 test B

Electrical Test not required. Magnification 50X. SMD conditions: 1st step

: method B, aging 4 hours at 155°C dry heat; 2nd step: leadfree solder

bath at 245±3°C; Dipping time: 3± 0.5 seconds

Well tinned (>95% covered)

No visible damage

Moisture

Resistance

MIL-STD-202 Method

106

Each temperature / humidity cycle is defined at 8 hours (Method 106G),

3 cycles / 24 hours for 10d. with 25°C / 65°C 95% R.H, without steps 7a

& 7b, un-powered Parts mounted on test board, without condensation

on parts. Measurement at 24±2 hours after test conclusion.

±(0.5% + 0.0005Ω)

No visible damage

Thermal

Shock

MIL-STD-202 Method

107

-55/+125°C. Number of cycles required is 300. Parts mounted on test

board. Maximum transfer time is 20 seconds. Dwell time is 15 minutes.

±(1.0% + 0.0005Ω)

Board Flex/

Bending

IEC 60115-1 4.33

Device mounted on PCB test board as described, only 1 board bend-

ing required. 2 mm bending. Bending time: 60±1 seconds. Ohmic value

checked during bending

±(1.0 % + 0.0005Ω)

Resistance

to Soldering

Heat

MIL-STD-202 Method

210

IEC 60115-1 4.18

Condition B, no pre-heat of samples. Leadfree solder, 260±5°C,

10±1seconds immersion time. Procedure 2 for SMD: devices fluxed and

cleaned with isopropanol

±(0.5% + 0.0005Ω)

No visible damage