9

ATR0797

4665D–SIGE–08/04

Figure 10. Demo Test Board (Fully Assembled PCB)

Figure 11. Recommended Package Footprint

Remark: Heatslug must be soldered to GND.

In order to avoid soldering problems, plugging of the vias under the heatslug is recom-

mended. Only ground signal traces are allowed directly under the package.

3.0

0.25

1.25

0.74

0.4

φ0.33 via

- Indicates metalization

- vias connect pad to underlying ground plane

all units are in mm

3.0

0.9

0.7

6.9

0.74