LTM8045 datasheet(22/30 Pages) LINER

22 / 30 page

LTM4649

4649fc

For more information www.linear.com/LTM4649

APPLICATIONS INFORMATION

Figure 16. Recommended PCB Layout

VOUT

GND

COUT

CIN

VIN

4649 F16

GND

Layout Checklist/Example

The high integration of LTM4649 makes the PCB board

layout very simple and easy. However, to optimize its

electrical and thermal performance, some layout con-

siderations are still necessary.

• Use large PCB copper areas for high current path,

including VIN, GND and VOUT. It helps to minimize the

PCB conduction loss and thermal stress.

• Place high frequency ceramic input and output capaci-

tors next to the VIN, GND and VOUT pins to minimize

high frequency noise.

• Place a dedicated power ground layer underneath the

unit.

• To minimize the via conduction loss and reduce module

thermal stress, use multiple vias for interconnection

between top layer and other power layers.

• Do not put vias directly on the pads, unless they are

capped.

• Use a separated SGND ground copper area for com-

ponents connected to signal pins. Connect the SGND

to GND underneath the unit.

Figure16givesagoodexampleoftherecommendedlayout.

LTM8045 Datasheet(PDF) 22 Page - Linear Technology