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LTM4677 Datasheet(PDF) 7 Page - Linear Technology |
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LTM4677 Datasheet(HTML) 7 Page - Linear Technology |
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7 / 34 page ![]() LTM4647 7 4647fb For more information www.linear.com/LTM4647 PIN FUNCTIONS VIN (A1-A3, B1-B2, C1-C2): Power Input Pins. Apply input voltage between these pins and GND pins. Recommend placing input decoupling capacitance directly between VIN pins and GND pins. GND (A4, A7, B3, C3, C4, D1-D4, E2-E4, F2, F4, F6, G1- G4, H1-H5, J5-J7, K5-K7): Ground Pins for Both Input and Output Returns. All ground pins need to connect with large copper areas underneath the unit. RUN (A6): Run Control Pin. A voltage above 1.35V will turn on the module. This is a 1µA pull-up current on this pin. Once the RUN pin rises above the 1.35V threshold the pull-up current increases to 5µA. PWM (B4): Control PWM Three-State Output Signal. For monitor and test purpose only. Do not drive this pin. CLKOUT (B5): Clock output with phase control using the PHASMD pin to enable multiphase operation between devices. See the Applications Information section. TEST1, TEST2, TEST3 (B6, D5, F7): These pins are for µModule initial test purposes. Please connect these pins to GND with a large GND copper area. MODE/PLLIN (B7): Mode Selection Pin and External Synchronization Pin. Connect this pin to SGND to force the module into force continuous current mode (CCM) of operation. Connect to INTVCC to enable pulse-skipping mode of operation. Leaving the pin floating will enable Burst Mode operation. A clock on the pin will force the module into continuous current mode of operation and synchronized to the external clock applied to this pin. See the Applications Information section. SVIN (D6): Signal VIN. Input voltage to the internal 5.5V regulator for the control circuitry of the regulator. Tie this pin to VIN pin through a 2.2Ω plus 1µF R-C filter in most application. See the Application Information section. DRVCC (C5): Power Input Pin for the MOSFET driver cir- cuitry. Connect to INTVCC output for the application with the input voltage 6V and above or connect this pin to an external supply 4.5V or above through a 2.2Ω plus 1µF R-C filter. See the Application Information section. INTVCC (C6): Internal 5.5V LDO for driving the control circuitry decouple with pin to GND with a minimum of 2.2µF low ESR ceramic capacitor. The 5.5V LDO has a 10mA current limit. PHASMD (C7): This pin determines the relative phases between the internal controllers and the phasing of the CLKOUT signal. See Table 2 in the Application Informa- tion section. FREQ (D7): Frequency Set Pin. A 20µA current is sourced from this pin. A resistor from this pin to ground sets a voltage that in turn programs the operating frequency. Alternatively, this pin can be driven with a DC voltage that can set the operating frequency. See the Applications Information section. HIZB(E5):PhaseSheddingInputPin.Whenthispinislow, TRACK/SS, COMP and PWM pin go to high impedance. Tie to INTVCC or VIN to disable this function. VFB (E6): The Negative Input of the Error Amplifier. Inter- nally, this pin is connected to VOSNS+ with a 60.4k 0.5% precision resistor. Different output voltages can be pro- grammed with an additional resistor between VFB and VSNS– pins. In PolyPhase® operation, tying the VFB pins together allows for parallel operation. See the Applications Information section for details. SGND (E7): Signal Ground Pin. Return ground path for all analog and low power circuitry. Tie a single connection to the output capacitor GND in the application. See layout guidelines in Figure 22. SW (F3): Switching node of the circuit is used for testing purposes. Also an R-C snubber network can be applied to reduce or eliminate switch node ringing, or otherwise leave floating. See the Applications Information section. TRACK/SS(F5):OutputVoltageTrackingPinandSoft-Start Inputs. The pin has a 1.25µA pull-up current. A capacitor from this pin to ground will set a soft-start ramp rate. In tracking, the regulator output can be tracked to a different voltage. The voltage ramp rate at his pin sets the voltage ramp rate of the output. See the Applications Information section. PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY. |
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