| Electronic Components Datasheet Search |
|
LT3758 Datasheet(PDF) 19 Page - Linear Technology |
|
|
|||||||||||||||||||||||||||||
LT3758 Datasheet(HTML) 19 Page - Linear Technology |
|
19 / 20 page ![]() LTC3872-1 19 38721f For more information www.linear.com/LTC3872-1 Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa- tion that the interconnection of its circuits as described herein will not infringe on existing patent rights. DDB Package 8-Lead Plastic DFN (3mm × 2mm) (Reference LTC DWG # 05-08-1702 Rev B) 2.00 ±0.10 (2 SIDES) NOTE: 1. DRAWING CONFORMS TO VERSION (WECD-1) IN JEDEC PACKAGE OUTLINE M0-229 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 0.40 ± 0.10 BOTTOM VIEW—EXPOSED PAD 0.56 ± 0.05 (2 SIDES) 0.75 ±0.05 R = 0.115 TYP R = 0.05 TYP 2.15 ±0.05 (2 SIDES) 3.00 ±0.10 (2 SIDES) 1 4 8 5 PIN 1 BAR TOP MARK (SEE NOTE 6) 0.200 REF 0 – 0.05 (DDB8) DFN 0905 REV B 0.25 ± 0.05 2.20 ±0.05 (2 SIDES) RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS 0.61 ±0.05 (2 SIDES) 1.15 ±0.05 0.70 ±0.05 2.55 ±0.05 PACKAGE OUTLINE 0.25 ± 0.05 0.50 BSC PIN 1 R = 0.20 OR 0.25 × 45° CHAMFER 0.50 BSC package DescripTion Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings. 1.50 – 1.75 (NOTE 4) 2.80 BSC 0.22 – 0.36 8 PLCS (NOTE 3) DATUM ‘A’ 0.09 – 0.20 (NOTE 3) TS8 TSOT-23 0710 REV A 2.90 BSC (NOTE 4) 0.65 BSC 1.95 BSC 0.80 – 0.90 1.00 MAX 0.01 – 0.10 0.20 BSC 0.30 – 0.50 REF PIN ONE ID NOTE: 1. DIMENSIONS ARE IN MILLIMETERS 2. DRAWING NOT TO SCALE 3. DIMENSIONS ARE INCLUSIVE OF PLATING 4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR 5. MOLD FLASH SHALL NOT EXCEED 0.254mm 6. JEDEC PACKAGE REFERENCE IS MO-193 3.85 MAX 0.40 MAX 0.65 REF RECOMMENDED SOLDER PAD LAYOUT PER IPC CALCULATOR 1.4 MIN 2.62 REF 1.22 REF TS8 Package 8-Lead Plastic TSOT-23 (Reference LTC DWG # 05-08-1637 Rev A) |
|
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |