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LTC3859AL Datasheet(PDF) 32 Page - Linear Technology

Part # LTC3859AL
Description  Low IQ, 60V Synchronous BoostBuck Controller
PDF  42 Pages
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Manufacturer  LINER [Linear Technology]
Direct Link  http://www.linear.com
Logo LINER - Linear Technology

LTC3859AL Datasheet(HTML) 32 Page - Linear Technology

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LTC7813
32
7813f
For more information www.linear.com/LTC7813
applicaTions inForMaTion
short leads and PC trace lengths. The output capacitor
(–) terminals should be connected as close as possible
to the (–) terminals of the input capacitor by placing
the capacitors next to each other and away from the
MOSFET loop described above.
2. Does the LTC7813 VFB pins’ resistive divider connect to
the (+) terminal of COUT? The resistive divider must be
connected between the (+) terminal of COUT and signal
ground. The feedback resistor connections should not
be along the high current input feeds from the input
capacitor(s).
3. Are the SENSE– and SENSE+ leads routed together with
minimumPCtracespacing?Thefiltercapacitorbetween
SENSE+ and SENSE– should be as close as possible
to the IC. Ensure accurate current sensing with Kelvin
connections at the SENSE resistor.
4. Is the DRVCCanddecouplingcapacitorconnectedclose
to the IC, between the DRVCC and the ground pin? This
capacitor carries the MOSFET drivers’ current peaks.
5. Keep the switching nodes (SW1, SW2), top gate (TG1,
TG2), and boost nodes (BOOST1, BOOST2) away from
sensitive small-signal nodes, especially from the other
channel’svoltageandcurrentsensingfeedbackpins.All
of these nodes have very large and fast moving signals
and therefore should be kept on the output side of the
LTC7813 and occupy minimum PC trace area.
6. Useamodifiedstargroundtechnique:alowimpedance,
large copper area central grounding point on the same
side of the PC board as the input and output capacitors
with tie-ins for the bottom of the DRVCC decoupling
capacitor, the bottom of the voltage feedback resistive
divider and the GND pin of the IC.
PC Board Layout Debugging
Start with one controller at a time. It is helpful to use a
DC-50MHz current probe to monitor the current in the
inductor while testing the circuit. Monitor the output
switching node (SW pin) to synchronize the oscilloscope
totheinternaloscillatorandprobetheactualoutputvoltage
as well. Check for proper performance over the operating
voltage and current range expected in the application. The
frequencyofoperationshouldbemaintainedovertheinput
voltage range down to dropout and until the output load
drops below the low current operation threshold—typi-
cally 25% of the maximum designed current level in Burst
Mode operation.
Thedutycyclepercentageshouldbemaintainedfromcycle
tocycleinawell-designed,lownoisePCBimplementation.
Variation in the duty cycle at a subharmonic rate can sug-
gest noise pickup at the current or voltage sensing inputs
or inadequate loop compensation. Overcompensation of
the loop can be used to tame a poor PC layout if regula-
tor bandwidth optimization is not required. Only after
each controller is checked for its individual performance
should both should multiple controllers be turned on at
the same time.
Reduce VIN from its nominal level to verify operation of
the regulator in dropout. Check the operation of the un-
dervoltage lockout circuit by further lowering VIN while
monitoring the outputs to verify operation.
Investigate whether any problems exist only at higher out-
put currents or only at higher input voltages. If problems
coincide with high input voltages and low output currents,
look for capacitive coupling between the BOOST, SW, TG,
and possibly BG connections and the sensitive voltage
and current pins. The capacitor placed across the current
sensing pins needs to be placed immediately adjacent to
the pins of the IC. This capacitor helps to minimize the
effects of differential noise injection due to high frequency
capacitive coupling. If problems are encountered with
high current output loading at lower input voltages, look
for inductive coupling between CIN, Schottky and the top
MOSFET components to the sensitive current and voltage
sensing traces. In addition, investigate common ground
path voltage pickup between these components and the
GND pin of the IC.
An embarrassing problem, which can be missed in an
otherwise properly working switching regulator, results
when the current sensing leads are hooked up backwards.
The output voltage under this improper hookup will still
be maintained but the advantages of current mode control
will not be realized. Compensation of the voltage loop will
be much more sensitive to component selection. This
behavior can be investigated by temporarily shorting out
the current sensing resistor—don’t worry, the regulator
will still maintain control of the output voltage.



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