LTC4234

18

4234fa

For more information www.linear.com/LTC4234

PACKAGE DESCRIPTION

Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.

5.00

±0.10

(2 SIDES)

PIN 1

TOP MARK

(SEE NOTE 6)

1

2

BOTTOM VIEW—EXPOSED PAD

3.59

±0.10

3.59

±0.05

4.14 ±0.10

2.93 ±0.10

4.14 ±0.05

2.93 ±0.05

9.00

±0.10

(2 SIDES)

3.59

±0.05

5.5

±0.05

4.1

±0.05

2.7

±0.05

3.59

±0.10

(WHH36MA) QFN 1212 REV Ø

7.50

REF

0.40 ±0.10

0.5 BSC

0.25 ±0.05

0.50 REF

1.22

REF

0.72

REF

0.203 REF

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

0.350 REF

0.00 – 0.05

SEATING PLANE

0.90

±0.10

0.70

±0.05

0.70

±0.05

0.35 REF

0.5 BSC

0.7

BSC

0.9 ±0.10

7.5 REF (2 SIDES)

0.25

±0.05

PACKAGE

OUTLINE

PIN 1 NOTCH

R = 0.30

WHH Package

Variation: WHH38MA

38-Lead Plastic QFN (5mm

× 9mm)

(Reference LTC DWG # 05-08-1934 Rev Ø)

0.7 BSC

2.7 REF

NOTE:

1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON THE TOP AND BOTTOM OF PACKAGE

0.5 REF

1.22 REF

0.72 REF