ICL3232IBZ datasheet(20/28 Pages) RENESAS

20 / 28 page

ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243

FN4805 Rev 22.00

Page 20 of 28

September 1, 2015

Package Outline Drawing

M16.173

16 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP)

Rev 2, 5/10

0.09-0.20

SEE DETAIL "X"

DETAIL "X"

TYPICAL RECOMMENDED LAND PATTERN

TOP VIEW

SIDE VIEW

END VIEW

Dimension does not include mold flash, protrusions or gate burrs.

Mold flash, protrusions or gate burrs shall not exceed 0.15 per side.

Dimension does not include interlead flash or protrusion. Interlead

flash or protrusion shall not exceed 0.25 per side.

Dimensions are measured at datum plane H.

Dimensioning and tolerancing per ASME Y14.5M-1994.

Dimension does not include dambar protrusion. Allowable protrusion

shall be 0.08mm total in excess of dimension at maximum material

condition. Minimum space between protrusion and adjacent lead

is 0.07mm.

Dimension in ( ) are for reference only.

Conforms to JEDEC MO-153.

NOTES:

(0.65 TYP)

(5.65)

(0.35 TYP)

0.90 +0.15/-0.10

0.60 ±0.15

0.15 MAX

0.05 MIN

PLANE

GAUGE

0°-8°

0.25

1.00 REF

(1.45)

PIN #1

I.D. MARK

5.00 ±0.10

6.40

4.40 ±0.10

0.65

1.20 MAX

SEATING

PLANE

0.25 +0.05/-0.06 5

0.20 C B A

0.10 C

- 0.05

0.10

C B A

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