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ICL3232IBZ Datasheet(PDF) 25 Page - Renesas Technology Corp |
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ICL3232IBZ Datasheet(HTML) 25 Page - Renesas Technology Corp |
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25 / 28 page ![]() ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243 FN4805 Rev 22.00 Page 25 of 28 September 1, 2015 Shrink Small Outline Plastic Packages (SSOP) NOTES: 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.20mm (0.0078 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. In- terlead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension “B” does not include dambar protrusion. Allowable dambar protrusion shall be 0.13mm (0.005 inch) total in excess of “B” dimension at maximum material condition. 10. Controlling dimension: MILLIMETER. Converted inch dimen- sions are not necessarily exact. INDEX AREA E D N 12 3 -B- 0.25(0.010) C A M B S e -A- B M -C- A1 A SEATING PLANE 0.10(0.004) C H 0.25(0.010) B M M L 0.25 0.010 GAUGE PLANE A2 M20.209 (JEDEC MO-150-AE ISSUE B) 20 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE SYMBOL INCHES MILLIMETERS NOTES MIN MAX MIN MAX A 0.068 0.078 1.73 1.99 A1 0.002 0.008’ 0.05 0.21 A2 0.066 0.070’ 1.68 1.78 B 0.010’ 0.015 0.25 0.38 9 C 0.004 0.008 0.09 0.20’ D 0.278 0.289 7.07 7.33 3 E 0.205 0.212 5.20’ 5.38 4 e 0.026 BSC 0.65 BSC H 0.301 0.311 7.65 7.90’ L 0.025 0.037 0.63 0.95 6 N20 20 7 0 deg. 8 deg. 0 deg. 8 deg. Rev. 3 11/02 |
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