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EFD25 Datasheet(PDF) 3 Page - NXP Semiconductors |
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EFD25 Datasheet(HTML) 3 Page - NXP Semiconductors |
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3 / 6 page ![]() 1997 Nov 21 3 Philips Components Product specification EFD cores and accessories EFD25 COIL FORMERS General data Winding data for EFD25 coil former with 10-pins PARAMETER SPECIFICATION Coil former material phenolformaldehyde (PF), glass-reinforced, flame retardant in accordance with “UL 94V-0”; UL file number E167521(M) Pin material copper-tin alloy (CuSn), tin-lead alloy (SnPb) plated Maximum operating temperature 180 °C, “IEC 85” class H Resistance to soldering heat “IEC 68-2-20”, Part 2, Test Tb, method 1B, 350 °C, 3.5 s Solderability “IEC 68-2-20”, Part 2, Test Ta, method 1 NUMBER OF SECTIONS WINDING AREA (mm2) MINIMUM WINDING WIDTH (mm) AVERAGE LENGTH OF TURN (mm) TYPE NUMBER 1 40.2 16.4 46.4 CSH-EFD25-1S-10P handbook, full pagewidth MGC343 5 0.05 1.3 0.15 0 O 13.1 0 0.1 12 0 0.2 18 0 0.2 18 (16.4 min) 0 0.2 0.8 10 3.6 20 25.2 max 22.5 26.2 max 12.5 max 11.7 0.1 0 5.5 0.1 0 6.9 0 0.1 22.5 Fig.2 EFD25 coil former; 10-pins. Dimensions in mm. |
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