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MXD2020GL Datasheet(PDF) 6 Page - List of Unclassifed Manufacturers

Part # MXD2020GL
Description  Improved, Ultra Low Noise Dual Axis Accelerometer with Digital Outputs
PDF  7 Pages
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Manufacturer  ETC [List of Unclassifed Manufacturers]
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MXD2020GL Datasheet(HTML) 6 Page - List of Unclassifed Manufacturers

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MEMSIC MXD2020GL/ML/NL/HL
Page 6 of 7
2002.08.29.1
CONVERTING THE DIGITAL OUTPUT TO AN
ANALOG OUTPUT
The PWM output can be easily converted into an analog
output by integration. A simple RC filter can do the
conversion. Note that that the impedance of the circuit
following the integrator must be much higher than the
impedance of the RC filter. Reference figure 4 for an
example.
1uF
DOUT
AOUT
10K
MEMSIC
Accel.
Figure 4: Converting the digital output to an analog voltage
POWER SUPPLY NOISE REJECTION
Two capacitors and a resistor are recommended for best
rejection of power supply noise (reference Figure 5 below).
The capacitors should be located as close as possible to the
device supply pins (VDA, VDD). The capacitor lead length
should be as short as possible, and surface mount capacitors
are preferred. For typical applications, capacitors C1 and
C2 can be ceramic 0.1 µF, and the resistor R can be 10 Ω.
In 5V applications where power consumption is not a
concern, maximum supply noise rejection can be obtained
by significantly increasing the values of C1, C2 and R. For
example, C1 = C2 = 0.47 µF and R = 270 Ω will virtually
eliminate power supply noise effects.
R
MEMSIC
Accelerometer
VDA
C1
C2
VDD
V SUPPLY
Figure 5: Power Supply Noise Rejection
PCB LAYOUT AND FABRICATION SUGGESTIONS
1. The Sck pin should be grounded to minimize noise.
2. Liberal use of ceramic bypass capacitors is
recommended.
3. Robust low inductance ground wiring should be used.
4. Care should be taken to ensure there is “thermal
symmetry” on the PCB immediately surrounding the
MEMSIC device and that there is no significant heat
source nearby.
5. A metal ground plane should be added directly beneath
the MEMSIC device. The size of the plane should be
similar to the MEMSIC device’s footprint and be as
thick as possible.
6. Vias can be added symmetrically around the ground
plane. Vias increase thermal isolation of the device
from the rest of the PCB.



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