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MXD2020GL Datasheet(PDF) 6 Page - List of Unclassifed Manufacturers |
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MXD2020GL Datasheet(HTML) 6 Page - List of Unclassifed Manufacturers |
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6 / 7 page ![]() MEMSIC MXD2020GL/ML/NL/HL Page 6 of 7 2002.08.29.1 CONVERTING THE DIGITAL OUTPUT TO AN ANALOG OUTPUT The PWM output can be easily converted into an analog output by integration. A simple RC filter can do the conversion. Note that that the impedance of the circuit following the integrator must be much higher than the impedance of the RC filter. Reference figure 4 for an example. 1uF DOUT AOUT 10K MEMSIC Accel. Figure 4: Converting the digital output to an analog voltage POWER SUPPLY NOISE REJECTION Two capacitors and a resistor are recommended for best rejection of power supply noise (reference Figure 5 below). The capacitors should be located as close as possible to the device supply pins (VDA, VDD). The capacitor lead length should be as short as possible, and surface mount capacitors are preferred. For typical applications, capacitors C1 and C2 can be ceramic 0.1 µF, and the resistor R can be 10 Ω. In 5V applications where power consumption is not a concern, maximum supply noise rejection can be obtained by significantly increasing the values of C1, C2 and R. For example, C1 = C2 = 0.47 µF and R = 270 Ω will virtually eliminate power supply noise effects. R MEMSIC Accelerometer VDA C1 C2 VDD V SUPPLY Figure 5: Power Supply Noise Rejection PCB LAYOUT AND FABRICATION SUGGESTIONS 1. The Sck pin should be grounded to minimize noise. 2. Liberal use of ceramic bypass capacitors is recommended. 3. Robust low inductance ground wiring should be used. 4. Care should be taken to ensure there is “thermal symmetry” on the PCB immediately surrounding the MEMSIC device and that there is no significant heat source nearby. 5. A metal ground plane should be added directly beneath the MEMSIC device. The size of the plane should be similar to the MEMSIC device’s footprint and be as thick as possible. 6. Vias can be added symmetrically around the ground plane. Vias increase thermal isolation of the device from the rest of the PCB. |
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