SSM2166

Data Sheet

Rev. F | Page 2 of 13

TABLE OF CONTENTS

Features .............................................................................................. 1

Applications....................................................................................... 1

General Description ......................................................................... 1

Functional Block Diagram and Typical Speech Application ...... 1

Revision History ............................................................................... 2

Specifications..................................................................................... 3

Absolute Maximum Ratings............................................................ 4

Thermal Resistance ...................................................................... 4

ESD Caution.................................................................................. 4

Pin Configuration and Function Descriptions............................. 5

Typical Performance Characteristics ..............................................6

Theory of Operation .........................................................................8

Applications Information.............................................................8

Signal Path......................................................................................8

Level Detector................................................................................9

Control Circuitry........................................................................ 10

Power-Down Feature ................................................................. 12

PCB Layout Considerations...................................................... 12

Outline Dimensions....................................................................... 13

Ordering Guide .......................................................................... 13

REVISION HISTORY

10/2016—Rev. E to Rev. F

Changes to Signal Path Section ...................................................... 9

Changes to Compression Ratio Section ...................................... 10

Changes to Downward Expansion Threshold Section.............. 11

Changes to PCB Layout Considerations Section ....................... 12

Deleted Evaluation Board Section and Figure 26; Renumbered

Sequentially ..................................................................................... 13

Deleted Figure 27 to Figure 29, Evaluation Board Examples

Section, and Table 5; Renumbered Sequentially ....................... 14

Deleted Figure 30, Evaluation Board Setup Procedure Section,

Test Equipment Setup Section, and Figure 31 ............................ 15

Deleted Setup Summary Section, Table 6, and Table 7 ............. 16

10/2013—Rev. D to Rev. E

Change to Compression Ratio Section........................................ 10

Changes to Ordering Guide .......................................................... 17

7/2008—Rev. C to Rev. D

Changes to Figure 4 through Figure 9 ........................................... 6

Changes to Figure 11 and Figure 12............................................... 7

Changes to Figure 19...................................................................... 10

Changes to Figure 26...................................................................... 13

Added Top Branding Revision Reflecting Die Replacement

Table ................................................................................................. 17

5/2008—Rev. B to Rev. C

Updated Format..................................................................Universal

Changes to Features Section and General Description Section ........1

Changes to Table 1.............................................................................3

Changes to Table 2.............................................................................4

Deleted TPC 3; Renumbered Sequentially.....................................4

Changes to Table 4, Pin 8 Description Column ............................5

Changes to Figure 5, Figure 6, Figure 8, and Figure 9..................6

Change to Figure 11 ..........................................................................7

Changes to Signal Path Section .......................................................9

Added Figure 19 ............................................................................. 10

Deleted Figure 14 and Figure 17................................................... 12

Deleted Other Versions Section ................................................... 13

Changes to Figure 26...................................................................... 13

Changes to Figure 27...................................................................... 14

Changes to Test Equipment Section ............................................ 15

Added Table 6 ................................................................................. 16

Added Table 7 ................................................................................. 16

Updated Outline Dimensions....................................................... 17

Changes to Ordering Guide.......................................................... 17

3/2003—Rev. A to Rev. B

Deleted PDIP Package .......................................................Universal

Change to General Description.......................................................1

Changes to Thermal Characteristics...............................................2

Changes to Ordering Guide.............................................................2

Deleted 14-Lead PDIP, Outline Dimensions .............................. 15

Updated 14-Lead Narrow-Body SOIC, Outline Dimensions... 15