TPS3820 datasheet(4/27 Pages) TI1

4 / 27 page

TPS3820-33-Q1, TPS3820-50-Q1, TPS3823-25-Q1

TPS3823-30-Q1, TPS3823-33-Q1, TPS3823-50-Q1, TPS3824-30-Q1, TPS3824-33-Q1

TPS3824-50-Q1, TPS3825-33-Q1, TPS3825-50-Q1, TPS3828-33-Q1, TPS3828-50-Q1

SGLS143C – DECEMBER 2002 – REVISED DECEMBER 2015

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7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

VDD

–0.3

Voltage

RESET, RESET, MR, WDI

–0.3

(VDD + 0.3)

Maximum low output, IOL

–5

Current

Maximum high output, IOH

–5

Output range (VO < 0 or VO > VDD), IOK

–10

Continuous total power dissipation

See Thermal Information

Operating free-air, TA

–40

125

Temperature

°C

Storage, Tstg

–65

150

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to GND.

7.2 ESD Ratings

VALUE

UNIT

Human-body model (HBM), per AEC Q100-002(1)

±2000

V(ESD)

Electrostatic discharge

Charged-device model (CDM), per AEC Q100-011

±750

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

7.3 Recommended Operating Conditions

over operating junction temperature range (unless otherwise noted).

MIN

NOM

MAX

UNIT

VDD

Supply voltage

1.1

5.5

Input voltage

VDD + 0.3

VIH

High-level input voltage at MR and WDI

0.7 × VDD

VIL

Low-level input voltage

0.3 × VDD

Δt/ΔV

Input transition rise and fall rate at MR or WDI

100

ns/V

Operating free-air temperature range

–40

125

°C

7.4 Thermal Information

TPS382x-xx-Q1

THERMAL METRIC(1)

DBV (SOT-23)

UNIT

5 PINS

RθJA

Junction-to-ambient thermal resistance

209.1

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

72.8

°C/W

RθJB

Junction-to-board thermal resistance

36.7

°C/W

ψJT

Junction-to-top characterization parameter

2.1

°C/W

ψJB

Junction-to-board characterization parameter

35.8

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

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Product Folder Links: TPS3820-33-Q1 TPS3820-50-Q1 TPS3823-25-Q1 TPS3823-30-Q1 TPS3823-33-Q1 TPS3823-

50-Q1 TPS3824-30-Q1 TPS3824-33-Q1 TPS3824-50-Q1 TPS3825-33-Q1 TPS3825-50-Q1 TPS3828-33-Q1

TPS3828-50-Q1

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