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ACPL-P302/ACPL-W302

Data Sheet

Thermal Model for ACPL-P302/W302

Streched-SO6 Package Optocoupler

Definitions

R11: Junction to Ambient Thermal Resistance of LED due

to heating of LED

R12: Junction to Ambient Thermal Resistance of LED due

to heating of Detector (Output IC)

R21: Junction to Ambient Thermal Resistance of Detector

(Output IC) due to heating of LED.

R22: Junction to Ambient Thermal Resistance of Detector

(Output IC) due to heating of Detector (Output IC).

P1: Power dissipation of LED (W).

P2: Power dissipation of Detector / Output IC (W).

T1: Junction temperature of LED (˚C).

T2: Junction temperature of Detector (˚C).

Ta: Ambient temperature.

∆T1: Temperature difference between LED junction and

ambient (˚C).

∆T2: Temperature deference between Detector junction

and ambient.

Ambient Temperature: Junction to Ambient Thermal Resistanc-

es were measured approximately 1.25 cm above optocoupler

at ~23°C in still air.

Description

This thermal model assumes that an 6-pin single-channel plas-

tic package optocoupler is soldered into a 7.62 cm x 7.62 cm

printed circuit board (PCB). The temperature at the LED and

Detector junctions of the optocoupler can be calculated using

the equations below.

T1 = (R11 × P1 + R12 × P2) + Ta -- (1)

T2 = (R21 × P1 + R22 × P2) + Ta -- (2)

Jedec Specifications

R11

R12, R21

R22

low K board

357

150, 166

228

high K board

249

76, 79

159

Notes:

1. Maximum junction temperature for above parts: 125 °C.

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